Advanced Package Technology Engineer (2.5D/3D Advanced Packaging)

Location: United States — San Jose, California, or Fort Collins, Colorado

Company

hirify.global develops ASIC products and advanced semiconductor packaging solutions.

What you will do

• Lead the development of cost-effective, high-performance custom packaging solutions meeting signal integrity, thermal, structural reliability, design rule, and schedule requirements.
• Act as the subject matter expert for 2.5D and 3D advanced packaging, defining customer needs and consolidating requirements into unified solutions.
• Lead identification, development, and qualification of packaging solutions with external assembly and memory partners.
• Collaborate with Design Integration, Package Design, Test Development, silicon, marketing, NPI, suppliers, and customers.
• Support design wins, New Product Introduction, high-volume manufacturing ramps, alternate sourcing, and qualification initiatives.

Requirements

• Ph.D. or Master’s degree in Mechanical, Electrical, or Electronics Engineering, with 10+ years of relevant experience.
• 6+ years of hands-on experience in 2.5D/3D package development and heterogeneous integration.
• Proven experience developing cost-effective, high-performance single- and multi-chip solutions optimized for speed, density, pin count, thermal performance, and reliability.
• Experience with large, complex, custom, fine-pitch flip-chip packages using advanced multi-layer ceramic or organic substrates, interposers, and wafer-level packaging.
• In-depth knowledge of silicon fabrication, bumping, interposer, substrate, and assembly processes; materials selection; supplier evaluation; BOM definition; and thermal-mechanical interactions.
• Knowledge of silicon, package, and substrate technologies, design rules, failure analysis, materials, equipment, industry standards, and quality systems.
• Hands-on experience with thermal and mechanical modeling tools and substrate/PCB design CAD tools such as APD, AutoCAD, or SolidWorks.
• Understanding of advanced-node silicon fabrication, PCB technologies, and board assembly processes.
• Strong analytical, problem-solving, project management, interpersonal, communication, and program-management skills, with the ability to manage multiple programs concurrently.

Nice to have

• None specified.

Culture & Benefits

• Cross-functional collaboration with global internal and external teams, suppliers, partners, and customers.
• Periodic travel may be required.
• Discretionary annual bonus, competitive new-hire equity grant, and annual equity awards are available subject to plan documents and award agreements.
• Benefits include medical, dental and vision plans, 401(k) participation with company matching, ESPP, EAP, paid holidays, paid sick leave, vacation, and applicable family and other leaves.
• Full-time employment in the United States.

Hiring process

• First-time applicants must create a candidate login account before applying; existing candidates must sign in before applying.
• Applicants located outside the USA should provide a home address for future correspondence.