Advanced Package Layout Engineer (AI)

Location: Mountain View, California, United States — onsite.

Salary: $200,000–$350,000 per year.

Company

Early-stage AI compute company developing a full-stack platform based on system-on-wafer architecture and advanced 3D integration to reduce power, latency, and infrastructure costs in AI clusters.

What you will do

• Own package substrate and interposer layout from stackup definition, bump and ball maps, RDL, and escape routing through manufacturing release and tape-out.
• Plan high-density routing and HBM-class channels alongside power and ground structures for accelerator rails carrying hundreds of amps.
• Collaborate with physical design engineers on die floorplans and bump placement and with PCB layout engineers on the package-to-board interface.
• Close package DRC/LVS and netlist verification against substrate supplier and OSAT design rules, including rule negotiation where required.
• Work with architecture, SI/PI, thermo-mechanical, and manufacturing partners to resolve trade-offs and achieve package sign-off.
• Develop and use AI-assisted tools to accelerate package layout, routing, and sign-off.

Requirements

• At least eight years of package layout experience on high-performance designs, including multi-die 2.5D and 3D packages.
• Strong practical experience with advanced packaging technologies such as CoWoS, EMIB, InFO, fan-out, or equivalent interposer technologies.
• Deep expertise in substrate and interposer routing, high-density escape, stackup design, and via structures.
• Experience designing power and ground planes for high-current accelerator rails.
• Hands-on experience with Cadence Allegro Package Designer / SiP Layout, Siemens Xpedition Package Designer, or equivalent tools.
• Practical ownership of package DRC/LVS, netlist verification, and design release.

Culture & Benefits

• Broad technical ownership of a critical part of an AI computing platform.
• Close collaboration with silicon, board, architecture, signal integrity, power integrity, thermo-mechanical, and manufacturing engineers.
• Responsibility for package releases used by manufacturing partners.
• Medical, dental, and vision insurance.
• 401(k) plan.