Advanced Packaging Development Engineer (Semiconductor Packaging)

Location: Hybrid role based at an hirify.global site in Chandler, Arizona or Phoenix, Arizona, United States, with time split between on-site and off-site work.

Annual salary: $133,800–188,890 USD.

Company

hirify.global's Advanced Packaging Technology Manufacturing organization develops and scales semiconductor packaging solutions for high-performance, edge, and mobile computing applications.

What you will do

• Develop, optimize, and qualify packaging assembly processes, materials, and equipment for quality, reliability, yield, and cost targets.
• Design and execute experiments using Statistical Process Control (SPC), Design of Experiments (DOE), and process characterization methods.
• Develop new techniques, materials, and tools to address packaging reliability and manufacturability challenges.
• Collaborate with cross-functional teams and suppliers to mitigate technical risks, define process specifications, and establish material requirements.
• Document technical findings, process improvements, and advancements in reports and technical papers.
• Support equipment performance and process health in development and high-volume manufacturing environments.

Requirements

• Bachelor's degree in Engineering, Physics, Chemistry, or a related STEM field and 3+ years of industry experience; or a Master's degree in a related field and 2+ years of industry experience; or a PhD in a related field with no prior professional experience.
• Experience with process development and/or equipment qualification for manufacturing applications.
• Strong communication skills for collaboration across diverse teams and stakeholders.
• Strong analytical skills, including data analysis and risk assessment.

Nice to have

• Experience leading technical teams and collaborating across matrixed organizations to drive innovation.
• Experience with SPC, DOE, and process characterization techniques.
• Experience with semiconductor fabrication processes, packaging flows, and assembly methodologies.
• Ability to deliver results in time-sensitive technical projects with a focus on process improvement.
• Knowledge of quality systems, documentation standards, and tools for packaging reliability evaluation.
• Proficiency in Python, MATLAB, or SQL for complex dataset analysis.

Culture & Benefits

• Hybrid work model combining on-site work at the assigned hirify.global site with off-site work.
• Health, retirement, and vacation benefits.
• Competitive pay and stock bonuses.
• Commitment to responsible business practices and ethical hiring.