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9 дней назад

Die Prep Module Engineer (Advanced Metrology)

Формат работы
onsite
Тип работы
fulltime
Английский
b2
Страна
Malaysia
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Die Prep Module Engineer (Advanced Metrology) (Semiconductor Manufacturing/Metrology): Owning and optimizing advanced metrology and inspection equipment for high-volume semiconductor packaging manufacturing with an accent on equipment reliability, measurement capability, and process control. Focus on troubleshooting hardware, software, and automation issues, developing metrology recipes, and leading equipment qualification, technology transfer, and capacity expansion projects.

Location: On-site in Kulim, Malaysia

Company

hirify.global's Wafer Packaging Manufacturing organization advances semiconductor packaging technologies and manufacturing excellence.

What you will do

  • Own the performance, capability, and reliability of advanced metrology and inspection equipment in the Die Prep module.
  • Troubleshoot hardware, software, automation, equipment, and process issues using root cause analysis and data-driven methods.
  • Improve tool uptime, productivity, reliability, measurement capability, yield, and quality through preventive maintenance and continuous improvement.
  • Use SPC, DOE, FMEA, and data analysis to identify trends and prevent process excursions.
  • Partner with Process Engineering, Manufacturing, Automation, and suppliers on technology transfers, NPI, and manufacturing ramps.
  • Develop metrology recipes and operating documentation, and lead equipment installation, qualification, upgrades, and capacity expansion projects.

Requirements

  • Bachelor's degree in Electrical, Electronics, Mechanical, Mechatronics, Materials Engineering, or a related field.
  • Knowledge of semiconductor manufacturing processes, preferably Die Prep, metrology, or advanced packaging.
  • Experience with SPC, DOE, FMEA, or similar statistical and problem-solving methodologies.
  • Strong troubleshooting and analytical skills, including diagnosing equipment and process issues through data-driven approaches.

Nice to have

  • Experience supporting metrology, inspection, or semiconductor manufacturing equipment in a high-volume production environment.
  • Success improving equipment performance, optimizing processes, or enhancing yield.
  • Knowledge of Root Cause Analysis, process control, and manufacturing data analytics.
  • Strong communication and collaboration skills for working with cross-functional teams and external suppliers.
  • Self-motivation and an interest in innovation, continuous improvement, and manufacturing excellence.

Culture & Benefits

  • Full-time hirify.global Contract Employee position.
  • On-site work model in Kulim, Malaysia.
  • Shift 1 schedule in Malaysia.
  • Work with cross-functional manufacturing, engineering, automation, and supplier teams on advanced packaging technologies.
  • hirify.global follows responsible business alliance compliance and ethical hiring practices; candidates are never charged recruitment, medical examination, or other hiring fees.

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