Senior Engineer (Semiconductor Manufacturing)

Location: Seremban, Malaysia; onsite

Company

hirify.global manufactures semiconductor components and operates semiconductor assembly processes.

What you will do

• Lead equipment restoration, major repairs, recovery projects, overhauls, refurbishments, and upgrades for Die Bond, Wire Bond, and Buffer equipment.
• Improve equipment reliability, uptime, productivity, quality, and maintenance cost performance.
• Perform root cause analysis and implement corrective and preventive actions for chronic equipment issues.
• Develop preventive and predictive maintenance programs, spare-parts strategies, and equipment performance improvement plans.
• Provide advanced troubleshooting support and collaborate with Production, Process Engineering, Manufacturing, Quality, Maintenance, vendors, and suppliers.
• Lead technician training, coaching, knowledge sharing, and technical competency development.

Requirements

• Bachelor’s degree in Electrical, Electronics, Mechanical, Mechatronics, Manufacturing Engineering, or a related field.
• 5–8 years of experience in semiconductor manufacturing, equipment engineering, or maintenance engineering.
• Experience with equipment restoration, major breakdown recovery, troubleshooting, and maintenance management.
• Strong knowledge of semiconductor assembly equipment and Die Bond, Wire Bond, and Buffer operations.
• Knowledge of TPM, preventive and predictive maintenance, reliability engineering, RCA, FMEA, SPC, DOE, and continuous improvement methods.
• Experience leading technicians and cross-functional improvement initiatives, with strong project management and technical leadership skills.

Culture & Benefits

• Inclusive recruitment process and equal-opportunity employment environment.
• Commitment to diversity, inclusion, and workplace accessibility.
• Employee resource groups, including the Pride Network Group and global and local Women’s groups.
• Safe work environment with reasonable adjustments available where requested.