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RTR Assembly Manager / Principal Engineer (Semiconductor Equipment Maintenance)

Формат работы
onsite
Тип работы
fulltime
Грейд
senior/lead
Английский
b2
Страна
Malaysia
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR
RTR Assembly Manager / Principal Engineer (Semiconductor Equipment Maintenance): Leading Front-End and Mid-End manufacturing equipment maintenance for Die Bond, Wire Bond, and other assembly equipment with an accent on reliability, uptime, and operational KPI performance. Focus on developing engineering and maintenance teams, solving recurring equipment issues, supporting automation and technology transfer, and improving OEE, MTBF, and MTTR through TPM, Lean, and Six Sigma.

Location: Seremban, Malaysia

Company

hirify.global is a semiconductor manufacturing company focused on high-volume assembly and test operations.

What you will do

  • Lead and develop engineers, supervisors, and technicians responsible for Front-End and Mid-End manufacturing equipment.
  • Drive equipment uptime, reliability, maintenance effectiveness, and operational KPI performance.
  • Manage preventive, predictive, and corrective maintenance, including troubleshooting and continuous improvement for Die Bond, Wire Bond, and other assembly equipment.
  • Analyze recurring equipment issues and implement sustainable solutions while collaborating with Production, Process Engineering, Quality, and Manufacturing Excellence teams.
  • Support equipment installation, qualification, upgrades, automation initiatives, and technology transfer projects.
  • Manage maintenance budgets, spare parts, service contracts, vendors, and compliance with safety, quality, environmental, and operational requirements.

Requirements

  • Bachelor’s degree in Electrical, Electronics, Mechanical, Mechatronics, or related Engineering.
  • 8+ years of experience in semiconductor manufacturing, equipment engineering, or maintenance, including at least 3+ years managing engineering, maintenance, or equipment teams.
  • Strong hands-on experience maintaining Front-End and Mid-End equipment, including Die Bond and Wire Bond equipment, in a semiconductor manufacturing environment.
  • Strong knowledge of equipment reliability, maintenance strategies, and continuous improvement methodologies.
  • Experience with OEE, MTBF, MTTR, TPM, Lean, Six Sigma, and preventive/predictive maintenance systems.
  • Proven results in equipment uptime, yield improvement, cost optimization, and operational excellence.
  • Strong leadership, problem-solving, project management, stakeholder management, and communication skills.
  • Ability to work effectively in a fast-paced manufacturing environment.

Nice to have

  • Experience in high-volume semiconductor assembly and test manufacturing.
  • Familiarity with Front-End and Mid-End assembly equipment platforms, automation systems, and Industry 4.0 solutions.
  • Experience managing equipment vendors, external service providers, and capital projects.
  • Six Sigma Green Belt or Black Belt certification.

Culture & Benefits

  • Full-time onsite role supporting manufacturing operations in Seremban.
  • Safety, accountability, innovation, and continuous improvement are expected in daily operations.
  • Equal-opportunity and inclusive workplace with fair consideration for applicants and reasonable adjustments where requested.
  • Employee resource groups include the Pride Network Group and global and local Women’s groups.

Hiring process

  • hirify.global does not appreciate talent acquisition based on its vacancies; its job adverts are copyrighted materials.

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