ATD MIHL Equipment Development Engineer (Semiconductor Packaging)
Контакты
99 030 - 188 890$
Формат работы
onsite
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
US
program managementsolidworksroboticsautocadmechanical designspcdoesemiconductor packaginggeometric dimensioning and tolerancing
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Зарплата и рынок
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$99к-189к/год
$120к$140кмедиана$150к
По похожим ролям (50) ~ $140к/год
На СНГ рынке: $1.4к/мес ($1.2к - $1.6к)
87
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Чётко очерченная инженерная роль в крупной технологической компании связана с разработкой упаковочных процессов, оборудования и надёжности; основные ограничения - работа на месте и отсутствие визового спонсорства.
Без визовой поддержки
Понятные задачи
Передовые полупроводники
?Работа на месте
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
ATD MIHL Equipment Development Engineer (Semiconductor Packaging): Developing and optimizing assembly processes, packaging equipment, and manufacturing workflows for next-generation semiconductor packaging with an accent on reliability, quality, yield, and manufacturability. Focus on applying DOE and SPC, designing equipment for simulated field conditions, defining material specifications, and solving packaging reliability and process improvement challenges.
Location: On-site in Phoenix, Arizona, United States
Salary: $99,030–$188,890 USD annual salary.
Company
hirify.global develops semiconductor products and assembly and packaging technologies for global markets.
What you will do
Develop and optimize assembly processes and equipment for quality, reliability, cost, yield, productivity, and manufacturability goals.
Apply Design of Experiments (DOE) and Statistical Process Control (SPC), refine specifications, and document findings in technical reports.
Design and maintain equipment for evaluating packaging technologies under simulated field conditions, including temperature cycles, humidity, heat, and dynamic forces.
Ensure manufacturability of physical package layouts and oversee manufacturing workflow lifecycles.
Define material specifications and collaborate with supplier quality and procurement teams.
Lead packaging reliability problem-solving, continuous improvement, equipment qualification, and manufacturing quality standardization.
Requirements
Bachelor’s degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 3+ years of relevant experience; or a master’s degree with 2+ years of relevant experience; or a PhD in one of these fields.
Experience with Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
Experience with mechanical design software such as SolidWorks or AutoCAD.
Experience with mechanical drawings, Geometric Dimensioning, and Tolerancing principles.
This position is not eligible for hirify.global immigration sponsorship.
Nice to have
Program management ability to lead technical innovation and manage complex, time-sensitive projects.
Experience with semiconductor fabrication processes, packaging technologies, and robotics.
Experience with supply chain management in a manufacturing or materials qualification environment.
Culture & Benefits
Full-time experienced-hire position with an on-site work model.
Shift 1 in the United States of America.
Benefits include health, retirement, and vacation programs, plus stock bonuses and competitive compensation.
hirify.global follows responsible business and ethical hiring practices and does not charge recruitment or employment-related fees.
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