Equipment Development Engineer, Laser Alignment & Photonic Packaging

Location: Shenzhen, Guangdong Province, China; Shenzhen Nanshan Office

Company

hirify.global develops large-scale data storage infrastructure for hyperscale data centers, cloud platforms, and enterprise systems supporting the AI-driven data economy.

What you will do

• Design and develop precision equipment, mechanisms, fixtures, and subsystems for laser alignment, optical attachment, photonic packaging, testing, and automation.
• Translate system and process requirements into robust solutions that balance precision, reliability, manufacturability, and cost.
• Develop precision positioning, alignment, motion control, and opto-mechanical systems for assembly and packaging processes.
• Perform tolerance analysis, GD&T, and precision alignment studies to ensure accuracy and repeatability.
• Create 3D models, engineering drawings, BOMs, and technical documentation using SolidWorks.
• Lead prototype builds, integration, debugging, verification, optimization, supplier engagement, NPI, equipment qualification, and manufacturing deployment while collaborating with optical, electrical, software, process, manufacturing, and quality teams.

Requirements

• Master’s degree or above in Mechanical Engineering, Mechatronics, Opto-Mechanical Engineering, Automation, or a related discipline.
• Strong experience in precision mechanical and opto-mechanical system design.
• Hands-on experience developing semiconductor equipment, automation systems, assembly equipment, inspection systems, or other complex electro-mechanical systems.
• Solid understanding of precision alignment, tolerance analysis, GD&T, materials, and manufacturing processes.
• Proficiency in SolidWorks and engineering documentation.
• Experience with system integration, troubleshooting, root cause analysis, and engineering validation.
• Strong problem-solving skills, ability to work independently in a fast-paced environment, and excellent communication and teamwork skills.

Nice to have

• Experience with active optical alignment, laser attach or die attach, optical module assembly, silicon photonics, photonic packaging, precision motion control or nanopositioning, machine vision or optical metrology, or semiconductor assembly equipment.

Culture & Benefits

• Full-time, exempt position within the Equipment Engineering function.
• Inclusive environment focused on diversity, belonging, respect, and contribution.
• Accommodation support is available for applicants with disabilities during the application and hiring process.
• hirify.global never requests payment as a condition of applying or receiving an offer.

Hiring process

• Applicants requesting accommodation should contact the provided accommodations email with the specific request, job title, and requisition number.