Senior / Staff Dry Etch Process Development Engineer (Semiconductor)

Location: On-site in Rio Rancho or Albuquerque, New Mexico, United States.

Annual salary: $155,520–$255,200 USD.

Company

Semiconductor manufacturing organization developing advanced processes and equipment solutions for innovative device architectures and high-volume production.

What you will do

• Lead the design, development, and implementation of technically sophisticated dry etch manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
• Drive process integration and develop solutions that meet device specifications for high-volume manufacturing and future technologies.
• Conduct feasibility studies, research, and pathfinding using theoretical simulations and practical engineering methods.
• Develop technology process roadmaps and strategies aligned with future manufacturing goals and cost requirements.
• Collaborate with equipment and materials suppliers and cross-functional engineering teams to advance processes and improve production output.
• Implement process and equipment modifications to improve efficiency, reliability, yield, scalability, and product performance.

Requirements

• PhD in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or a related STEM field, plus at least 5 years of semiconductor Dry Etch/Plasma Etch process development experience; OR a Master’s degree in a listed engineering or materials discipline plus at least 7 years of relevant experience; OR a Bachelor’s degree in a listed engineering or materials discipline plus at least 10 years of relevant experience.
• At least 2 years of experience applying Design of Experiments (DOE) and Statistical Process Control (SPC) in semiconductor process development and optimization.
• At least 2 years of experience leading cross-functional semiconductor process development projects across process engineering, integration, yield, and equipment engineering, and driving technical solutions toward project and manufacturing objectives.

Nice to have

• Experience with advanced Dry Etch/Plasma Etch technologies, including Through-Silicon Via (TSV) processes.
• Experience in semiconductor foundry or advanced technology development environments.
• Experience with process automation systems and advanced process control methodologies.
• Experience collaborating with semiconductor equipment suppliers on process optimization, development, and implementation.
• Experience improving yield, defect reduction, process stability, and manufacturing performance.
• Experience leading technical work groups that solve complex dry etch problems using model-based problem solving (MBPS).
• Demonstrated technical leadership in complex semiconductor process development initiatives involving multiple engineering teams.

Culture & Benefits

• On-site work model with Shift 1 scheduling in the United States.
• Health, retirement, and vacation benefits.
• Competitive pay and stock bonuses.
• Work with cross-functional and global teams on advanced semiconductor manufacturing technology.