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2 дня назад

Senior Director, Integration & Yield – 200mm (Semiconductor Manufacturing)

198 000 - 333 000$
Тип работы
fulltime
Грейд
director
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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TL;DR
Senior Director, Integration & Yield – 200mm (Semiconductor Manufacturing): Leading end-to-end integration, yield, characterization, contamination-free manufacturing, and metrology for a 200mm semiconductor fab with an accent on yield performance, process integration, and defect reduction. Focus on driving technology transfer, resolving complex manufacturing and reliability issues, and developing high-performing engineering organizations.

Location: Essex Junction, Vermont, United States

Salary: $198,000–$333,000 per year

Company

hirify.global operates a global semiconductor manufacturing network focused on technology development, production, and cross-fab collaboration.

What you will do

  • Lead integration and yield strategy across the 200mm fab, aligning site goals with global technology roadmaps.
  • Own yield performance, monitoring systems, KPIs, governance, and long-term improvement plans.
  • Lead process integration, electrical and process characterization, technology qualification, and new product introduction.
  • Drive root cause analysis for yield excursions, defectivity, reliability, and systemic manufacturing issues.
  • Oversee contamination-free manufacturing, metrology, inspection, inline monitoring, and process control.
  • Build and develop engineering organizations across integration, characterization, CFM, and metrology.

Requirements

  • Bachelor’s degree in Electrical Engineering, Materials Science, Physics, or a related field; a Master’s degree or PhD is preferred.
  • 15+ years of experience in semiconductor manufacturing or technology development.
  • 5+ years of leadership experience in integration, yield, or process engineering organizations.
  • Deep expertise in semiconductor process integration, device physics, yield engineering, defect reduction, and statistical process control.
  • Experience with characterization, failure analysis, reliability methodologies, and complex fab manufacturing problems.
  • Ability to lead cross-functional initiatives and influence senior leaders, customers, and global teams.

Nice to have

  • Experience in 200mm semiconductor manufacturing.
  • Background in GaN, RF, analog, power, or automotive specialty technologies.
  • Experience supporting technology transfer across global fabs.

Culture & Benefits

  • Collaborative global working environment with an emphasis on accountability, innovation, and operational excellence.
  • Work includes engagement with global engineering, product, customer, and manufacturing teams.
  • Employment is subject to applicable pre-employment conditions and laws.
  • Reasonable workplace accommodations are available upon request.

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