Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Чётко очерченная senior-роль даёт заметное техническое влияние на создание первого AI-чипа, но ранняя стадия стартапа связана с риском реализации планов.
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Выше рынкаПередовой AIПонятные задачиРиск стартапа
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Chip Architect (AI): Developing a next-generation ASIC and specialized accelerator for large language model inference with an accent on microarchitecture, compute architecture, memory hierarchies, interconnects, and data movement. Focus on translating architectural concepts into implementable hardware, optimizing throughput, latency, power, performance, and area, and supporting first-generation silicon through tapeout readiness.
Location: Palo Alto, California, United States; onsite.
Salary: $250,000–$400,000 per year.
Company
Early-stage, venture-backed AI semiconductor startup developing a specialized accelerator and software stack for large language model inference.
What you will do
Translate inference system requirements into detailed chip- and block-level microarchitecture specifications.
Develop architecture across compute, memory hierarchy, interconnects, and data movement.
Evaluate throughput, latency, power, performance, and area trade-offs using quantitative analysis.
Collaborate with RTL, design verification, and physical design engineers to translate architecture into efficient hardware and resolve implementation constraints.
Analyze workload characteristics, hardware utilization, and performance bottlenecks to improve inference efficiency.
Support first-generation silicon development, design integration, implementation trade-offs, tapeout readiness, and future accelerator architecture.
Requirements
Extensive experience in ASIC/SoC architecture or microarchitecture, with ownership of significant hardware design decisions.
Strong understanding of digital hardware architecture and complex semiconductor implementation challenges.
Deep expertise in compute architectures, memory hierarchies, interconnects, and data movement.
Ability to translate architectural concepts into detailed, implementable microarchitecture.
Experience evaluating throughput, latency, power, performance, and area trade-offs.
Understanding of how architectural decisions affect RTL implementation, verification, and physical design.
Ability to analyze complex hardware performance bottlenecks and develop quantitative, evidence-based solutions.
Experience collaborating with RTL, verification, and physical design engineering teams.
Staff-to-Principal-level technical depth and willingness to remain hands-on in architecture development and engineering problem-solving.
Nice to have
Experience architecting AI accelerators, inference ASICs, GPUs, or other high-performance compute processors.
Familiarity with LLM inference workloads and specialized machine learning accelerator architectures.
Experience with performance modeling, workload characterization, and architecture exploration.
Knowledge of memory bandwidth optimization, compute utilization, and efficient data movement.
Experience taking semiconductor architectures through RTL implementation, physical closure, and tapeout.
Involvement in successful ASIC/SoC tapeouts and post-silicon performance analysis.
Experience developing first-generation silicon or working at an early-stage semiconductor startup.
Culture & Benefits
Hands-on ownership of microarchitectural decisions and hardware implementation strategy.
Direct collaboration across architecture, RTL, verification, and physical design.
Technical involvement in first-generation silicon and future chip architectures.
Medical, dental, and vision insurance, plus a 401(k).
Hiring process
Two to three conversations focused on previous technical projects, chip architecture experience, and engineering problem-solving.
References may be requested.
Further company, technology, and roadmap details are shared under NDA as the process progresses.
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