Director Design Engineering (AI/ML)

Location: Richardson, United States; Austin is also listed as another location.

Expected salary: $191,000–$332,000 per year.

Company

hirify.global is a full-service semiconductor foundry providing design, development, and fabrication services with a global manufacturing footprint.

What you will do

• Lead complex SoC, AI/ML, networking, compute, and edge-processing product design and execution.
• Drive front-end development from architecture definition through RTL implementation, integration, synthesis, timing closure, and tape-out readiness.
• Establish design methodologies, quality metrics, execution frameworks, and modern AI-driven design flows.
• Guide technical decisions involving performance, power, area, reliability, manufacturability, and product cost.
• Build and lead multidisciplinary design organizations across architecture, RTL, integration, verification, DFT, physical design, and silicon bring-up.
• Collaborate with architecture, verification, DFT, physical design, package design, software, product engineering, foundry, operations, customers, IP providers, EDA vendors, and technology partners.

Requirements

• Bachelor's, Master's, or Ph.D. in Electrical Engineering, Computer Engineering, or a related field.
• 15+ years of semiconductor design experience with progressive technical and leadership responsibility.
• 8+ years of engineering management experience, including leadership of senior technical teams.
• Proven delivery of multiple successful ASIC/SoC tape-outs across advanced technology nodes.
• Strong hands-on front-end design expertise, including RTL design and integration, microarchitecture development, synthesis, CDC/lint, DFT and test methodologies, timing closure, and design verification collaboration.
• Deep understanding of complete RTL-to-GDSII development flows.
• Experience with large-scale, complex SoC designs involving multiple IPs, subsystems, and cross-functional teams.
• Strong customer-facing and executive communication skills.

Nice to have

• Experience delivering products on 7nm, 5nm, 3nm, and beyond technology nodes.
• Experience with AI/ML accelerators, compute platforms, networking, automotive, or high-performance computing products.
• Familiarity with chiplets, 2.5D, and 3D integration.
• Experience working directly with leading foundries and ecosystem partners.
• Understanding of low-power design methodologies, power management, and system-level optimization.
• Background in customer engagements, strategic partnerships, and technology roadmap development.

Culture & Benefits

• Work across a global manufacturing and technology organization.
• Collaborate with teams and partners across multiple disciplines and geographies.
• Support environmental, health, safety, and security requirements.
• Employment is subject to applicable pre-employment conditions and equal opportunity policies.