electrical engineeringpciesignal integritypower integrityddrpcb designserdespower deliveryhigh speed digital designsi pi simulation
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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В Company hidden чётко описана senior-роль с техническим лидерством и влиянием на платформы; главный компромисс - обязательная работа в офисе в Пенанге.
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Только офисПонятная зона ответственностиСерьёзная инженерная глубинаКрупный производитель чипов
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Текст:
Hirify AI/Оригинал
TL;DR
Platform Signal/Power Integrity Engineer Lead (High-Speed Hardware/SI/PI): Defining, developing, and delivering signal integrity and power integrity solutions for next-generation validation and product platforms with an accent on high-speed interface implementation, PCB design review, simulation, and electrical validation. Focus on leading root-cause analysis, debugging signal and power delivery failures, correlating simulations with laboratory measurements, and driving robust platform architectures.
Location: On-site in Penang, Malaysia
Company
hirify.global develops semiconductor and computing platform technologies.
What you will do
Lead Signal Integrity and Power Integrity activities for complex platform, board, and package designs.
Perform pre-layout and post-layout SI/PI simulations, analyze channel loss, reflection, crosstalk, jitter, timing margin, power delivery, power noise, and voltage droop.
Define and review high-speed interface implementation requirements for DDR4/DDR5, PCIe Gen4–Gen6, USB4/Thunderbolt, Ethernet, CXL, and high-speed SerDes links.
Correlate simulation results with laboratory measurements, lead board bring-up and validation debugging, and drive root-cause analysis and corrective actions.
Lead cross-functional SI/PI reviews, mentor engineers, and provide technical leadership across platform, silicon, package, validation, and manufacturing organizations.
Requirements
Bachelor's, Master's, or PhD degree in Electrical Engineering, Electronics Engineering, Computer Engineering, or a related field.
9+ years of experience in Signal Integrity, Power Integrity, Platform Hardware Design, or Board Design.
Strong understanding of high-speed digital design, power delivery architectures, SI/PI fundamentals, transmission line theory, channel modeling, termination techniques, and power distribution network analysis.
Experience with high-speed PCB design and implementation, schematic review, and board-level electrical analysis.
Experience analyzing crosstalk, reflection, jitter, eye diagrams, S-parameters, power noise, and voltage droop.
Proven debugging and root-cause analysis skills, with strong communication and cross-functional collaboration abilities.
Experience using electrical measurement equipment such as oscilloscopes, VNAs, TDR/TDT equipment, logic analyzers, and protocol analyzers.
Nice to have
Experience with Cadence Sigrity, Cadence Allegro, Ansys HFSS, Ansys SIwave, ADS, SPICE-based simulation tools, or power-aware SI/PI simulation tools.
Experience reviewing and signing off schematics, PCB layouts, routing constraints, and SI/PI compliance requirements.
Experience defining routing guidelines and electrical design rules for high-speed interfaces.
Familiarity with package-board co-design methodologies and knowledge of DFM, DFT, and reliability considerations.
Demonstrated experience with DDR4/DDR5, LPDDR4/LPDDR5, PCIe Gen4/Gen5/Gen6, USB4/Thunderbolt, Ethernet, SATA, CXL, UCIe, or high-speed SerDes technologies.
Culture & Benefits
On-site work model in Penang, Malaysia.
Shift 1 schedule aligned with Malaysia.
Collaboration across platform, silicon, package, PCB layout, firmware, validation, and manufacturing teams.
Commitment to responsible business practices and ethical hiring; no recruitment, medical examination, or other hiring fees are charged.
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