Packaging Module Equipment Development Engineer (Semiconductor Packaging)

Location: On-site in Chandler, Arizona / Phoenix, Arizona, United States; regular on-site presence is required.

Annual salary: $133,800–$188,890 USD.

Company

hirify.global develops semiconductor technologies and advanced packaging solutions for mobile, edge, and high-performance computing applications.

What you will do

• Develop, optimize, and qualify advanced semiconductor packaging assembly processes, materials, and hardware configurations for yield, reliability, and cost targets.
• Manage first-time process integration and equipment selection, particularly for dispense, mold, and cure technologies.
• Develop reliability simulation and testing systems for silicon and packaging technologies under heat, humidity, temperature cycling, and dynamic-force conditions.
• Design experiments, apply statistical process control, analyze manufacturing data, and optimize process windows and productivity.
• Define raw material and tooling specifications and collaborate with contract assemblers, material vendors, procurement, and supplier quality teams.
• Drive quality risk detection, factory standardization, technical documentation, and technology transfers across multiple hirify.global manufacturing sites.

Requirements

• Bachelor’s degree in Mechanical, Electrical, Material Science, Chemical Engineering, or a related STEM field with 4+ years of relevant semiconductor industry experience; or a Master’s degree in a matching STEM discipline with 3+ years of relevant semiconductor industry experience; or a PhD in a matching STEM discipline with 6+ months of relevant semiconductor industry experience.
• Experience using Statistical Process Control (SPC) or Design of Experiments (DOE) principles in a high-tech manufacturing environment.
• Experience managing technical change control, equipment sustaining, or quality data systems.
• Experience with structured problem solving, sound hypothesis development, and data-driven validation plans.
• Strong leadership skills for guiding cross-functional teams, influencing design partners, and managing complex, time-sensitive technical projects.
• Strong communication and interpersonal skills for collaborating across diverse matrixed organizations.
• Analytical problem-solving ability focused on complex hardware and process challenges.
• Self-directed, action-oriented decision making and adaptability to new methods, tools, and fields of study.

Nice to have

• 2+ years of hands-on semiconductor packaging process development or equipment engineering experience.
• 2+ years managing first-time process integration, tooling selection, or equipment qualifications involving dispense, mold, or cure hardware.
• 2+ years managing complex, time-critical technical projects from development through manufacturing transfer.

Culture & Benefits

• On-site work in advanced packaging laboratories with hands-on access to equipment, materials, and development tools.
• Health, retirement, and vacation benefits.
• Competitive pay and stock bonuses.
• Opportunity to work with cross-functional engineering teams on next-generation semiconductor manufacturing technologies.