Packaging Engineer II, New College Grad - Master's (Semiconductor)

Location: Santa Clara, California, United States; onsite role with 10% travel. Relocation eligible.

Salary: $90,000–$124,000 per year

Company

hirify.global develops materials science and engineering solutions used to produce semiconductor chips and advanced displays.

What you will do

• Develop, implement, and maintain packaging designs for product assemblies and parts.
• Generate packaging piece-part and material specifications.
• Research and implement packaging materials, equipment, and methods.
• Perform root cause analysis for packaging failures and recommend corrective actions.
• Identify cost-saving opportunities through packaging, materials, equipment, processes, and sourcing changes.
• Release specifications through the Engineering Change Order process and provide basic support to Packaging Engineer I.

Requirements

• Graduating with a Master's degree in Mechanical Engineering, Packaging Engineering, or a related field.
• Good academic standing at the university; a GPA of 3.0 or above on a 4.0 scale is preferred.
• Must be able to work in Santa Clara, California.

Culture & Benefits

• Supportive environment focused on learning, development, and career growth.
• Health and wellbeing programs with a comprehensive benefits package.
• Potential eligibility for bonus and stock award programs.
• Inclusive culture that encourages collaboration and professional growth.
• Relocation support eligibility and approximately 10% travel.