SI/PI Tech Project Manager

Location: On-site at the hirify.global office in Fort Collins, Colorado, or San Jose, California, 5 days a week. This is not a remote-work position.

Annual base salary range: USD to USD; discretionary annual bonus and equity awards are also available.

Company

hirify.global develops high-performance semiconductor and ASIC solutions for artificial intelligence, networking, high-performance computing, and 5G base stations.

What you will do

• Track the technical execution of 20+ concurrent package and PCB design projects, including scope, schedules, and resources.
• Organize engineering, customer, and vendor activities to keep projects on track.
• Communicate plans, status, next steps, and risks clearly and regularly.
• Create technical methodologies for signal integrity and power integrity solutions.
• Support package and PCB technologies and collaborate on high-performance ASIC designs involving SerDes, optics, RF/microwave ADC/DAC, HBM, and DDR.
• Coordinate cross-functional and external vendor collaboration across a worldwide R&D team.

Requirements

• Previous experience managing people and projects.
• BSEE or similar degree with 12+ years of work experience, or MSEE or similar degree with 10+ years, or PhD in electrical engineering or similar field with 7+ years.
• Knowledge of package-level, PCB-level, and/or system-level signal integrity and power integrity for package and PCB designs.
• Ability to cooperate with worldwide teams across multiple time zones, including co-design with internal engineers and external vendor designers.
• Self-management, organization, and clear communication skills.
• Technical understanding of system signal and power integrity development and support, including project management, automation code development, EDA extractions and simulations, SerDes channel results, and passive and active lab measurements.
• Experience or understanding of lab measurement correlation, lab equipment needs and management, package and PCB lifecycles and design flows, and package/substrate trade-offs within overall system implementation.
• Understanding of design data creation and use, including MCM files, package spreadsheets, drawings, PODs, lids, and substrates.

Culture & Benefits

• On-site, highly collaborative work with direct real-time engagement with lab equipment and face-to-face team co-design.
• Medical, dental, and vision plans.
• 401(k) participation with company matching and an Employee Stock Purchase Program.
• Employee Assistance Program, company-paid holidays, paid sick leave, vacation time, and applicable paid family and other leave.
• Discretionary annual bonus, competitive new-hire equity grant, and annual equity awards.