Technical Project Management Lead (Semiconductor)

Location: Pavia, Lombardy, Italy, with a later move to Milan; willingness to work in the office in Pavia or Milan is required. Relocation support may be available.

Salary: €78,480–€117,720 per year, determined based on qualifications, experience, and location.

Company

hirify.global is a semiconductor manufacturer providing design, development, manufacturing, and process technology solutions for global customers.

What you will do

• Lead complex IC development programs from initial planning through product release and mass production.
• Act as the primary interface between engineering teams, customers, suppliers, partners, and executive stakeholders.
• Establish project management processes, governance models, planning frameworks, and reporting mechanisms.
• Coordinate cross-functional work across design, packaging, manufacturing, qualification, business, and customer organizations.
• Manage program scope, schedules, risks, dependencies, resources, and change management.
• Lead and mentor project managers and provide status updates, risk assessments, and strategic recommendations to leadership.

Requirements

• Bachelor’s, Master’s, or PhD degree in Engineering or a related technical discipline.
• Significant experience in semiconductor product development, including IC design and product realization.
• Proven experience leading large-scale cross-functional programs involving engineering teams, customers, suppliers, and external partners.
• Strong knowledge of project and program management methodologies, governance, risk management, and resource planning.
• Experience managing complex stakeholder environments and influencing decisions across multiple organizational levels.
• Leadership experience, including mentoring project managers and coordinating multifunctional teams.
• Excellent communication, collaboration, and executive presentation skills.
• Fluent English language skills in written and spoken communication.
• Willingness to work in the office in Pavia or Milan.

Nice to have

• Experience managing ASIC, SoC, power management, or advanced packaging development programs.
• Familiarity with AI, data center, high-performance computing, or semiconductor infrastructure markets.
• PMP, PgMP, PRINCE2, Agile, or equivalent project management certification.
• Experience working with global engineering organizations and international customers.

Culture & Benefits

• Relocation support may be available.
• Global collaboration across engineering, customer, supplier, partner, and business organizations.
• Equal opportunity workplace committed to cultural diversity and inclusion.