Mold Process Development Engineer (Semiconductor)

Location: Seremban, Malaysia; onsite

Company

hirify.global develops semiconductor technologies and package solutions.

What you will do

• Develop and characterize new molding process technologies for semiconductor packages.
• Lead technical communication, information flow, and molding discussions within project teams.
• Conduct competitor benchmarking and technology studies to support the package technology roadmap.
• Provide technical input on assembly processes and equipment for new products and platforms.
• Assess process integration risks, develop mitigation plans, and establish robust package manufacturability and reliability.
• Provide molding support to internal and external customers and drive technical challenges with cross-site teams.

Requirements

• Bachelor’s degree in Engineering or a related technical discipline.
• 1–2 years of experience in a manufacturing environment, preferably in the semiconductor industry.
• Hands-on experience with molding backend assembly processes.
• Strong knowledge of semiconductor assembly and molding processes.
• Familiarity with process development methodologies, including Design of Experiments (DOE), Failure Mode and Effects Analysis (FMEA), and statistical analysis.
• Proficiency in DOE, Statistical Process Control (SPC), FMEA, 8D Problem Solving, and Minitab or equivalent statistical software.
• Knowledge of Six Sigma principles and process optimization techniques.
• Strong analytical, troubleshooting, communication, teamwork, stakeholder management, and relationship-building skills, with written and verbal proficiency in English.
• Ability to identify process risks, develop mitigation strategies, influence technical discussions, manage multiple priorities, and work proactively in a fast-paced development environment.

Nice to have

• Experience with wire-bonded and clip-bonded package technologies.
• Exposure to other End-of-Line (EOL) assembly processes.
• Demonstrated leadership potential and a customer-focused approach.

Culture & Benefits

• Work with cross-functional and global teams in a dynamic development environment.
• Inclusive recruitment and workplace practices with reasonable adjustments available when requested.
• Employee resource groups, including the Pride Network Group and global and local Women’s groups.
• Commitment to increasing women in management positions to 30% by 2030.