Sr Staff Wafer Metrology Integration Lead Engineer (Semiconductor)
Контакты
132 974 - 193 814$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior/lead
Английский
b2
Страна
US
data analysisstatistical analysisprocess controlsemiconductornanotechnologyphotolithographythin filmwafer metrology
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Зарплата и рынок
$133к-194к/год
$130к$160кмедиана$190к
По похожим ролям (50) ~ $160к/год
На СНГ рынке: $3к/мес ($1.9к - $3к)
87
Хорошая вакансия
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Чётко описанная ведущая инженерная роль в известной компании-производителе полупроводниковых устройств, с конкретными задачами и широким соцпакетом; важно учитывать работу на производстве и координацию между площадками.
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Работа на производствеПонятная зона ответственностиВлияние на технологиюШирокий соцпакет
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Sr Staff Wafer Metrology Integration Lead Engineer (Semiconductor): Developing and implementing wafer characterization and process-control metrology for advanced recording-head technology with an accent on measurement accuracy, process integration, and cross-functional control plans. Focus on closing metrology gaps, leading multidisciplinary projects, and integrating measurement methods with factory control systems across the wafer-to-HGSA supply chain.
Location: Normandale, United States; onsite work in a clean-room wafer process environment. Travel up to 10%.
Estimated base salary: $132,974.40–$193,814.40 per year.
Company
hirify.global develops and manufactures recording-head technology and advanced storage products.
What you will do
Understand new process flows and product builds and assess their impact on metrology and test performance.
Establish product and material characterization metrology roadmaps, identify critical gaps, and secure stakeholder commitments for closure.
Develop robust and accurate measurement processes for new transducer processes and designs with metrology and process owners.
Lead cross-functional projects improving process-control effectiveness through combinations of measurements and factory-control systems across the wafer-to-HGSA supply chain.
Document measurement and control methods at product and process transfer-readiness checkpoints, including process-control flow diagrams and roadmap input.
Coordinate cross-site and cross-functional implementation of control plans and measurement-content standards across both wafer sites.
Requirements
5+ years of relevant experience in thin-film research or the technology industry.
Intimate knowledge of measurement techniques used in nanotechnology device fabrication for characterization and manufacturing control.
Experience with data-analysis applications and statistical analysis.
Ability to lead multidisciplinary projects outside the nominal area of expertise.
Ability to identify opportunities and gaps and develop and execute team plans with minimal management guidance.
Strong analytical, leadership, communication, and documentation skills.
BS in Physics, Materials Science, Electrical Engineering, Chemical Engineering, or another relevant field with 12+ years of experience; or MS with 8+ years; or PhD with 5+ years.
Nice to have
Ability to manage shifting priorities between stakeholders across functional boundaries.
Experience with mask design, thin-film deposition, ion milling, ICP etch, plating, CMP, photolithography, design, or wafer metrology.
Culture & Benefits
On-site café, fitness center, wellness programs, meditation rooms, indoor walking path, cultural events, and community volunteer opportunities.
Medical, dental, vision, life insurance, short- and long-term disability, 401(k), employee stock purchase plan, health savings account, dependent-care and healthcare spending accounts.
Discretionary bonus eligibility, paid time off, 12 holidays, at least 48 hours of paid sick leave, and 16 weeks of paid parental leave.
Benefits are based on a full-time schedule and may vary by work location.
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