Packaging Module Development Engineer (Semiconductor Packaging)

Location: On-site in Chandler, Arizona, United States; primary location listed as Phoenix, Arizona, United States.

Annual salary: $133,800–$188,890 USD.

Company

hirify.global develops and commercializes semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms.

What you will do

• Develop, qualify, and implement thermal interface and warpage mitigation solutions for future packaging platforms.
• Optimize advanced assembly processes for quality, reliability, cost, yield, productivity, and high-volume scalability.
• Research and qualify next-generation materials, specialized assembly equipment, and fabrication processes.
• Manage engineering project milestones aligned with technology development and product timelines.
• Apply statistical methods, structural judgment, and materials analysis to resolve complex packaging assembly failures.
• Provide sustaining engineering support for equipment performance and process health in high-volume manufacturing lines and respond to foundry customer technical requests.

Requirements

• Master’s degree or PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, Applied Physics, or a related STEM field.
• At least 1 year of experience in materials characterization, packaging process development, or mechanical testing through academic research, coursework, internships, military training, or industry experience.
• Minimum GPA of 3.5 on a 4.0 scale.
• At least one publication as a primary or contributing author in a peer-reviewed technical journal.
• Strong critical thinking, interpersonal, collaboration, adaptability, autonomy, and technical leadership skills, including the ability to coach, develop, and lead technical teams.

Nice to have

• At least 1 year of experience in semiconductor packaging technology development, including hands-on use of Statistical Process Control (SPC) or Design of Experiments (DOE).
• Experience executing complex, time-critical engineering projects in a semiconductor foundry or manufacturing environment.
• Experience using Python, MATLAB, or SQL to analyze multidimensional engineering datasets.

Culture & Benefits

• On-site work model at the Chandler, Arizona campus.
• Collaboration with global teams and industry leaders within a matrixed organization.
• Health, retirement, and vacation benefits.
• Competitive pay and stock bonuses.
• Shift 1 schedule in the United States.