Advanced Packaging Cryogenic Modeling Engineer

Location: Essex Junction, United States; travel up to 10%

Salary: $118,000–$239,000 per year

Company

hirify.global is a full-service semiconductor foundry providing design, development, and fabrication services with a global manufacturing footprint.

What you will do

• Develop, correlate, and apply cryogenic thermal, mechanical, and/or electrical models for semiconductor devices and advanced packages at 77 K and below.
• Model temperature-dependent material properties, boundary conditions, thermal contraction, CTE mismatch, and other thermo-mechanical effects.
• Perform stress simulations for continuous and discontinuous active areas and assess effects on device performance when applying mechanical modeling.
• Anticipate integration and process issues using information from integration, process, and design enablement teams.
• Facilitate discussions to identify simulations that expose critical process interactions and support 3DHI technology decisions.
• Interact extensively with integration, device, and design engineers to develop working technology while supporting safety and EHS&S programs.

Requirements

• M.S. degree and at least 10 years of relevant experience.
• Experience with semiconductor mechanical, thermal, and/or electrical simulation tools, including Ansys Mechanical Workbench or applicable software.
• Experience developing and correlating cryogenic models with temperature-dependent material properties and boundary conditions.
• Strong problem-solving and technical troubleshooting skills, including expertise in design of experiments.
• Overall GPA of at least 3.0 and proven good academic standing.
• Fluent written and verbal English.
• Solid understanding of semiconductor processes and integration techniques.
• Good computer and software skills, with the ability to clearly present results to small and large groups.

Nice to have

• PhD with 8 years of relevant experience.
• Thermal and electrical simulation for specific IC circuit designs, preferably RF analog, with LVS and DRC verification tools such as Cadence, Mentor Graphics, or Keysight ADS.
• Experience performing in environments requiring strong attention to detail and timeliness.
• Prior leadership experience in the workplace, school projects, or competitions.
• Project management skills, including innovating and executing solutions and navigating ambiguity.
• Strong written and verbal communication, planning, and organizational skills.

Culture & Benefits

• Full-time employment at a semiconductor foundry.
• Work includes collaboration across integration, device, design, process, and design enablement teams.
• Activities must be performed safely and responsibly in support of Environmental, Health, Safety & Security requirements and programs.
• Employment is subject to applicable pre-employment conditions and laws.
• Equal opportunity employment with reasonable accommodation available during the hiring process.