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Роль четко сосредоточена на физической верификации ASIC для передовых техпроцессов в крупной полупроводниковой компании: обязанности конкретны, а техническая глубина высокая. Главное ограничение - обязательная работа в офисе в Сан-Хосе.
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Четкая специализация
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Principal Physical Verification Engineer (ASIC): Executing chip-level physical verification and resolving integration issues for advanced-node custom ASICs supporting AI, ML, PCIe switch, and enterprise products with an accent on foundry rules, DFM, tapeout, and 2.5D/3D chiplet integration. Focus on developing verification flows, managing DRC/LVS/ERC/PERC methodologies, optimizing runtime, and resolving top-level floorplan, I/O, bump, assembly, and density challenges.
Location: San Jose, California, USA. Must work in person at the San Jose site; no remote work is allowed.
Annual base salary: USD 143,800–230,000, plus a discretionary annual bonus and potential equity awards.
Company
hirify.global’s ASIC Products Division develops custom high-performance silicon solutions for hyperscale cloud providers, AI companies, and networking infrastructure leaders.
What you will do
Execute chip-level physical verification and resolve related issues.
Set up DRM runsets for advanced nodes and verification tool flows.
Manage rules for top-level floorplanning, I/O planning, and bump planning.
Resolve physical design issues related to chip integration and assembly.
Provide technical direction for DRC, LVS, ERC, and PERC verification methodologies.
Develop physical verification best practices and runtime optimizations.
Requirements
Bachelor’s degree in Electrical Engineering or Electronics Engineering.
12+ years of relevant experience.
Hands-on experience running physical verification using LVS, DRC, ERC, and PERC.
Experience with EDA tools and flows such as ICV, Calibre, and Pegasus.
Rule-deck coding experience in ICV, Calibre, or Pegasus.
Experience resolving chip-level DRC, LVS, and EMIR issues for advanced nodes, including silicon tapeout experience.
Experience analyzing ESD, latch-up, floating-gate, and power-domain isolation vulnerabilities through ERC/PERC.
Experience managing automated dummy metal, poly, and diffusion filling to meet local and global density rules.
Experience implementing DFM fixes, including critical-area analysis, via doubling, and edge-displacement rules.
Experience collaborating with physical design and place-and-route teams to resolve top-level integration bottlenecks.
Excellent verbal and written communication skills.
Must work in person at the San Jose site; remote work is not allowed.
Nice to have
Experience with scripting languages such as Python, Tcl, or Perl.
Culture & Benefits
Work within a physical design team developing advanced 3nm and 2nm silicon and 2.5D/3D chiplet solutions.
Medical, dental, and vision plans.
401(k) participation with company matching and an Employee Stock Purchase Program.
Employee Assistance Program, company-paid holidays, paid sick leave, vacation, and applicable paid family and other leaves.
Discretionary annual bonus and potential new-hire and annual equity awards, subject to plan documents.
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