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12 дней назад

Principal Physical Verification Engineer (ASIC)

143 800 - 230 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR
Principal Physical Verification Engineer (ASIC): Executing chip-level physical verification and resolving integration issues for advanced-node custom ASICs supporting AI, ML, PCIe switch, and enterprise products with an accent on foundry rules, DFM, tapeout, and 2.5D/3D chiplet integration. Focus on developing verification flows, managing DRC/LVS/ERC/PERC methodologies, optimizing runtime, and resolving top-level floorplan, I/O, bump, assembly, and density challenges.

Location: San Jose, California, USA. Must work in person at the San Jose site; no remote work is allowed.

Annual base salary: USD 143,800–230,000, plus a discretionary annual bonus and potential equity awards.

Company

hirify.global’s ASIC Products Division develops custom high-performance silicon solutions for hyperscale cloud providers, AI companies, and networking infrastructure leaders.

What you will do

  • Execute chip-level physical verification and resolve related issues.
  • Set up DRM runsets for advanced nodes and verification tool flows.
  • Manage rules for top-level floorplanning, I/O planning, and bump planning.
  • Resolve physical design issues related to chip integration and assembly.
  • Provide technical direction for DRC, LVS, ERC, and PERC verification methodologies.
  • Develop physical verification best practices and runtime optimizations.

Requirements

  • Bachelor’s degree in Electrical Engineering or Electronics Engineering.
  • 12+ years of relevant experience.
  • Hands-on experience running physical verification using LVS, DRC, ERC, and PERC.
  • Experience with EDA tools and flows such as ICV, Calibre, and Pegasus.
  • Rule-deck coding experience in ICV, Calibre, or Pegasus.
  • Experience resolving chip-level DRC, LVS, and EMIR issues for advanced nodes, including silicon tapeout experience.
  • Experience analyzing ESD, latch-up, floating-gate, and power-domain isolation vulnerabilities through ERC/PERC.
  • Experience managing automated dummy metal, poly, and diffusion filling to meet local and global density rules.
  • Experience implementing DFM fixes, including critical-area analysis, via doubling, and edge-displacement rules.
  • Experience collaborating with physical design and place-and-route teams to resolve top-level integration bottlenecks.
  • Excellent verbal and written communication skills.
  • Must work in person at the San Jose site; remote work is not allowed.

Nice to have

  • Experience with scripting languages such as Python, Tcl, or Perl.

Culture & Benefits

  • Work within a physical design team developing advanced 3nm and 2nm silicon and 2.5D/3D chiplet solutions.
  • Medical, dental, and vision plans.
  • 401(k) participation with company matching and an Employee Stock Purchase Program.
  • Employee Assistance Program, company-paid holidays, paid sick leave, vacation, and applicable paid family and other leaves.
  • Discretionary annual bonus and potential new-hire and annual equity awards, subject to plan documents.

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