CBS E2E Finance Architect (SAP)

Location: Hybrid work model across assigned sites in Phoenix, Arizona; Folsom and Santa Clara, California; and Hillsboro, Oregon, with time split between on-site and off-site work.

Salary: $188,330–$363,860 USD annual salary range for US locations.

Company

hirify.global offers a corporate environment with Finance transformation, technology, and manufacturing-related operations.

What you will do

• Own and govern the end-to-end Finance target architecture, solution designs, integration patterns, and architectural standards.
• Lead architecture across SAP FICO, accounting and subledgers, product costing, fixed assets, Project Accounting, SAP PaPM, and SAC Planning for FP&A.
• Design solutions for semiconductor manufacturing finance, including inventory valuation, Material Ledger, work in process, overhead allocation, production variances, yield, scrap, and profitability analysis.
• Lead architecture for treasury, cash and liquidity management, banking connectivity, tax integration with Thomson Reuters ONESOURCE, and financial controls.
• Provide design authority across validation, build, integration testing, user acceptance testing, data migration, cutover, stabilization, and post-transformation enhancements.
• Govern cross-functional integrations, mentor solution leads, resolve complex production issues, and communicate architectural decisions to senior Finance and IT stakeholders.

Requirements

• Successful delivery of at least one end-to-end SAP Finance transformation in the semiconductor industry as a Finance architect or equivalent design lead, from design through go-live and stabilization.
• 12+ years of SAP Finance experience, including 5+ years leading solution architecture or enterprise Finance design for complex, global organizations.
• Bachelor’s degree in Accounting, Finance, Information Systems, Engineering, or a related discipline, or equivalent relevant professional experience.
• Deep functional and architectural expertise in SAP FICO, including SAP S/4HANA Finance, accounting and subledgers, product costing, fixed assets, and Project Accounting.
• Solution design and delivery experience with both SAP PaPM and SAC Planning for FP&A, including integration with core Finance systems.
• Strong understanding of semiconductor manufacturing economics, inventory and product costing, capital-intensive operations, and their impact on accounting and planning.
• Experience governing cross-functional integrations, financial data migration and reconciliation, testing, cutover, and post-production stabilization.
• Ability to translate accounting policies and business requirements into solution designs, lead cross-team design decisions, and influence senior Finance and IT stakeholders.
• Ability to pass an extended Position of Trust background investigation, subject to applicable country law.

Nice to have

• Experience across integrated device manufacturing, foundry, fabless, or outsourced assembly and test operating models.
• Advanced hands-on expertise in PaPM allocation and profitability models or SAC planning models, data actions, and scenario simulations.
• Experience with SAP Group Reporting, SAP Datasphere, BW/4HANA, SAP BTP, or enterprise planning and data platforms.
• Experience with global Finance templates, multi-country deployments, parallel accounting, intercompany processes, and transfer-pricing integration.
• Experience establishing a Finance architecture practice or center of excellence and improving close efficiency, costing accuracy, planning effectiveness, and system reliability.

Culture & Benefits

• Hybrid work model combining on-site work at an assigned site with off-site work.
• Health, retirement, and vacation benefit programs.
• Total compensation package including competitive pay and stock bonuses.
• Employment practices provide consideration without discrimination on legally protected characteristics.