Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Зарплата и рынок
$181к-367к/год
$160к$200кмедиана$230к
По похожим ролям (50) ~ $200к/год
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Хорошая вакансия
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В HPE чётко описана сложная аппаратная роль с ответственностью за весь цикл разработки, но очень широкий набор требований к опыту и работа в офисе могут подойти не всем.
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Планка опытаСложные системыПолный цикл разработкиРабота в офисе
Оценка от Hirify AI
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Sr. Principal Hardware Engineer (FPGA): Designing next-generation networking hardware and liquid-cooled, high-performance scale-up systems with an accent on high-speed signaling, dense high-power PCB design, FPGA development, and signal and power integrity. Focus on architecting 100G/200G+ interconnects, integrating electrical, thermal, and mechanical systems, and bringing complex boards from concept through production.
Location: Onsite in Sunnyvale, California, United States of America.
Annual base salary: USD 181,000–367,000 in California; variable incentives may also be offered.
Company
hirify.global is an edge-to-cloud technology company developing infrastructure that connects, protects, analyzes, and processes data and applications.
What you will do
Own the complete hardware design lifecycle from system architecture and concept development through schematics, PCB layout, bring-up, validation, qualification, and production.
Lead high-performance, high-density, high-power circuit-board design with demanding electrical, thermal, and mechanical constraints.
Design systems using 100G, 200G, and higher-speed serial signaling and interconnects.
Develop and review schematics, power architectures, clocking solutions, high-speed interfaces, and board-level architectures.
Design FPGA-based solutions, including device selection, configuration, interfaces, implementation, bring-up, and hardware/firmware integration.
Drive signal integrity and power integrity analysis and collaborate on liquid cooling, mechanical integration, and system-level thermal solutions.
Requirements
10+ years of hands-on hardware or board design experience with complex, high-performance electronic systems.
10+ years of experience designing high-speed systems with 100G/200G-class signaling or comparable high-bandwidth interfaces.
10+ years of experience designing high-power, extremely dense PCBs and electronic systems.
10+ years of hands-on FPGA design experience, including independently designing and implementing FPGA-based solutions.
10+ years of experience with Signal Integrity and Power Integrity principles.
10+ years of experience with scale-up systems and high-performance computing, networking, AI/ML, accelerator, or similarly demanding architectures.
10+ years of experience with liquid cooling systems, including liquid-cooled hardware and system architectures.
Excellent communication and collaboration skills, with the ability to work across hardware, firmware, software, mechanical, thermal, and manufacturing teams.
Ability to define architectures, make engineering tradeoffs, solve ambiguous technical problems, and deliver production-ready systems.
Culture & Benefits
Onsite work primarily from an HPE office.
Health and wellbeing benefits for employees and their loved ones.
Personal and professional development programs supporting technical expertise and career growth.
Inclusive workplace focused on collaboration, individual uniqueness, and flexible management of work and personal needs.
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