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7 дней назад

Sr. Principal Hardware Engineer (FPGA)

181 000 - 367 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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TL;DR
Sr. Principal Hardware Engineer (FPGA): Designing next-generation networking hardware and liquid-cooled, high-performance scale-up systems with an accent on high-speed signaling, dense high-power PCB design, FPGA development, and signal and power integrity. Focus on architecting 100G/200G+ interconnects, integrating electrical, thermal, and mechanical systems, and bringing complex boards from concept through production.

Location: Onsite in Sunnyvale, California, United States of America.

Annual base salary: USD 181,000–367,000 in California; variable incentives may also be offered.

Company

hirify.global is an edge-to-cloud technology company developing infrastructure that connects, protects, analyzes, and processes data and applications.

What you will do

  • Own the complete hardware design lifecycle from system architecture and concept development through schematics, PCB layout, bring-up, validation, qualification, and production.
  • Lead high-performance, high-density, high-power circuit-board design with demanding electrical, thermal, and mechanical constraints.
  • Design systems using 100G, 200G, and higher-speed serial signaling and interconnects.
  • Develop and review schematics, power architectures, clocking solutions, high-speed interfaces, and board-level architectures.
  • Design FPGA-based solutions, including device selection, configuration, interfaces, implementation, bring-up, and hardware/firmware integration.
  • Drive signal integrity and power integrity analysis and collaborate on liquid cooling, mechanical integration, and system-level thermal solutions.

Requirements

  • 10+ years of hands-on hardware or board design experience with complex, high-performance electronic systems.
  • 10+ years of experience designing high-speed systems with 100G/200G-class signaling or comparable high-bandwidth interfaces.
  • 10+ years of experience designing high-power, extremely dense PCBs and electronic systems.
  • 10+ years of hands-on FPGA design experience, including independently designing and implementing FPGA-based solutions.
  • 10+ years of experience with Signal Integrity and Power Integrity principles.
  • 10+ years of experience with scale-up systems and high-performance computing, networking, AI/ML, accelerator, or similarly demanding architectures.
  • 10+ years of experience with liquid cooling systems, including liquid-cooled hardware and system architectures.
  • Excellent communication and collaboration skills, with the ability to work across hardware, firmware, software, mechanical, thermal, and manufacturing teams.
  • Ability to define architectures, make engineering tradeoffs, solve ambiguous technical problems, and deliver production-ready systems.

Culture & Benefits

  • Onsite work primarily from an HPE office.
  • Health and wellbeing benefits for employees and their loved ones.
  • Personal and professional development programs supporting technical expertise and career growth.
  • Inclusive workplace focused on collaboration, individual uniqueness, and flexible management of work and personal needs.

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