Sr. Staff, Signal Integrity and Power Integrity Engineer

Location: Westlake Village, California, United States

Expected base pay: $142,700–$211,230 per annum

Company

hirify.global develops semiconductor solutions and microelectronic technologies for enterprise, cloud, AI, and carrier data infrastructure.

What you will do

• Develop advanced high-speed IC packages for semiconductor data rates of 448 Gb/s and beyond.
• Perform package electrical design, electromagnetic modeling, characterization, and signal and power integrity analysis while accounting for manufacturing and assembly tolerances.
• Work with package suppliers to select package technologies, drive layout, ensure manufacturability, and meet performance, reliability, and cost requirements.
• Coordinate with assembly development, IC physical layout, analog and digital design, marketing, and other cross-functional teams.
• Develop achievable package specifications and contribute to new package technology development.

Requirements

• Bachelor’s degree in Computer Science, Electrical Engineering, or a related field with 5–8 years of related professional experience, or a Master’s/PhD in these fields with 1–3 years of experience.
• Strong fundamentals in electromagnetics, transmission lines, and microwave theory.
• Experience using 2-D and 3-D electromagnetic simulation tools such as Ansys HFSS, SI-Wave, or Cadence Clarity.
• Ability to manage package development across cross-functional teams and familiarity with IC package layout tools such as APD or PADS.
• Ability to automate signal integrity, power integrity, and packaging activities using scripting tools such as Python.
• Working knowledge of circuit design tools including Spectre, ADS, and HSpice.
• Experience with VNA and TDR measurements for package and PCB characterization, plus frequency-domain and time-domain high-speed signaling analysis.
• Experience with high-speed electronic packaging for digital and analog ICs; power-plane design, modeling, and analysis using tools such as PowerSI or SIwave.
• Familiarity with packaging technologies, materials, package substrate design rules, and assembly rules.
• Understanding, debugging, and simulation of EMI/EMC problems.
• Strong communication, presentation, documentation, and teamwork skills.

Nice to have

• Familiarity with co-packaged optics and optics packaging.
• Experience with 2.5D/3D package development.
• Track record of new product introduction from concept through development and production.
• Knowledge of thermal and mechanical analysis for IC package development.
• Experience with channel simulations using MATLAB, ADS, or other tools.

Culture & Benefits

• Full-time employment with eligibility for bonus and equity plans, including a new-hire equity grant and annual equity refreshers.
• Employee stock purchase plan with a two-year lookback.
• Family support programs, mental health resources, and physical health benefits.
• Recognition and service awards.

Hiring process

• Interviews evaluate individual experience, thought process, and communication skills in real time.
• AI tools, transcription apps, real-time answer generators, and automated note-taking bots are not permitted during interviews.
• The position may require export-control eligibility or an export license review for access to controlled technology and software.