Sr Failure Analysis Engineer (2027 New College Graduate) (Semiconductor)

Location: USA - New York - Malta; onsite at hirify.global' 300mm fabrication facility in Malta, New York. Must be able to relocate to Malta, NY. Travel up to 10%.

Expected salary: $69,000–$120,000 per year. Exact salary depends on qualifications, experience, and location.

Company

hirify.global manufactures essential semiconductors for high-growth markets, including AI applications, through customer partnerships and power-efficient, high-performance technologies.

What you will do

• Support advanced failure analyses that meet turnaround-time requirements without compromising quality.
• Collaborate with laboratory shift teams, engineers, and managers to define analytical methods, align analysis expectations, and interpret results.
• Work with Process Integration, Process Module, Product Engineering, and Customer Engineering organizations to meet technology requirements and deadlines.
• Improve workflow optimization, cycle time, equipment utilization, and cost.
• Participate in continuous-improvement activities and laboratory process enhancements.
• Communicate analysis results and technical information verbally and in writing with peers and cross-functional teams while following Environmental, Health, Safety & Security requirements.

Requirements

• Graduating with a Master's degree in Physics, Materials Science, Optical Engineering, Electrical Engineering, Mechanical Engineering, Chemical Engineering, or a related field from an accredited degree program.
• Overall GPA of at least 3.0 and proven good academic standing.
• English fluency in written and verbal communication.
• Ability to relocate to Malta, New York.

Nice to have

• Related internship or co-op experience.
• Leadership experience in the workplace, school projects, or competitions.
• Interest in leveraging AI tools and emerging technologies to improve productivity, streamline workflows, and support decision-making.
• Project management skills, including innovating and executing solutions and navigating ambiguity.
• Strong written and verbal communication, planning, and organizational skills.
• Failure-analysis experience, preferably involving wafer processes, semiconductor materials, or device characterization.
• Hands-on experience with failure-localization methods including OBIRCH, emission microscopy, thermal microscopy, laser-based techniques, electron-beam-based failure analysis, and TEM imaging.
• Experience with sample preparation and cross-sectioning, plus analytical techniques such as SEM, FIB, X-ray analysis, C-SAM, Auger electron spectroscopy, AFM, or SIMS.
• Self-driven approach, exceptional analytical skills, structured work style, and ability to understand complex matters quickly.
• Proficiency in MS Office Suite.

Culture & Benefits

• Full-time employment path for new college graduates.
• Accelerated training in a fast-paced work environment.
• Cross-functional working opportunities and talent mobility.
• Mentorship, networking, and leadership opportunities.
• Commitment to workplace diversity, equal opportunity, security, longevity, and sustainability.