Senior Process Integration Engineer (Advanced Packaging)
Контакты
Формат работы
hybrid
Тип работы
fulltime
Грейд
senior
Английский
c1
Страна
Taiwan
manufacturingsupplier managementyield improvementprocess integrationadvanced packagingprocess qualificationlead time analysissubstrate manufacturing
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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В Company hidden предлагается четко очерченная senior-роль в сфере передовой упаковки с содержательной инженерной работой с поставщиками, но обязательные 4 дня в неделю на заводе и отсутствие зарплаты оставляют важные условия неясными.
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Много времени на заводеЗарплата не указанаПонятные задачиПередовая упаковка чиповСильный бренд
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Текст:
Hirify AI/Оригинал
TL;DR
Senior Process Integration Engineer (Advanced Packaging): Developing and integrating substrate manufacturing processes for next-generation EMIB-T packaging solutions with an accent on supplier collaboration, capacity management, yield improvement, and lead-time reduction. Focus on qualifying new factory capacity, optimizing bottleneck processes, managing production ramps, and resolving delivery and process-control issues at supplier facilities.
Location: Taipei or Hsinchu, Taiwan; hybrid work model with on-site presence at a supplier factory for at least 4 days per week.
Company
hirify.global develops substrate packaging technologies for heterogeneous chip architectures and next-generation EMIB-T advanced packaging solutions.
What you will do
Work with supplier engineering teams and hirify.global’s US integration group to advance substrate technologies and manage critical process interactions.
Monitor and optimize bottleneck processes to reduce throughput time and improve manufacturing efficiency.
Manage product and test vehicle delivery schedules, resolving issues to meet on-time delivery targets.
Analyze substrate lead times, create reduction roadmaps, and track quarterly lead-time targets.
Ensure supplier adherence to Process Control System commitments and implement factory certification plans focused on yield improvement.
Lead qualification activities, startup micro-schedules, and ramp monitoring for new factory capacity while providing data-driven recommendations to supplier management.
Requirements
Bachelor’s degree in Science or Engineering with 10+ years of relevant experience, Master’s degree with 8+ years, or PhD with 6+ years.
8+ years of experience in fab back-end or substrate manufacturing process development.
Proficiency in supplier management, yield improvement, and lead-time analysis.
Hands-on experience with structured problem-solving and influencing suppliers.
Nice to have
Expertise in substrate process building blocks, including component embedding, laser drilling, dielectric lamination, lithography, multi-metal electrolytic plating, defect inspection and metrology, and electrical testing.
Experience with process tool qualification in technology development, ramp, or high-volume manufacturing environments.
Familiarity with factory operations, substrates, manufacturing, process engineering, and yield improvement.
Fluent English communication skills, exceptional presentation abilities, and confidence engaging with supplier management.
Culture & Benefits
Hybrid work model allowing time to be split between the assigned hirify.global site and off-site work.
Collaboration with global hirify.global teams and suppliers across substrate packaging technology development.
Full-time experienced-hire position on Taiwan Shift 1.
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