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4 дня назад

Senior Process Integration Engineer (Advanced Packaging)

Формат работы
hybrid
Тип работы
fulltime
Грейд
senior
Английский
c1
Страна
Taiwan
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR
Senior Process Integration Engineer (Advanced Packaging): Developing and integrating substrate manufacturing processes for next-generation EMIB-T packaging solutions with an accent on supplier collaboration, capacity management, yield improvement, and lead-time reduction. Focus on qualifying new factory capacity, optimizing bottleneck processes, managing production ramps, and resolving delivery and process-control issues at supplier facilities.

Location: Taipei or Hsinchu, Taiwan; hybrid work model with on-site presence at a supplier factory for at least 4 days per week.

Company

hirify.global develops substrate packaging technologies for heterogeneous chip architectures and next-generation EMIB-T advanced packaging solutions.

What you will do

  • Work with supplier engineering teams and hirify.global’s US integration group to advance substrate technologies and manage critical process interactions.
  • Monitor and optimize bottleneck processes to reduce throughput time and improve manufacturing efficiency.
  • Manage product and test vehicle delivery schedules, resolving issues to meet on-time delivery targets.
  • Analyze substrate lead times, create reduction roadmaps, and track quarterly lead-time targets.
  • Ensure supplier adherence to Process Control System commitments and implement factory certification plans focused on yield improvement.
  • Lead qualification activities, startup micro-schedules, and ramp monitoring for new factory capacity while providing data-driven recommendations to supplier management.

Requirements

  • Bachelor’s degree in Science or Engineering with 10+ years of relevant experience, Master’s degree with 8+ years, or PhD with 6+ years.
  • 8+ years of experience in fab back-end or substrate manufacturing process development.
  • Proficiency in supplier management, yield improvement, and lead-time analysis.
  • Hands-on experience with structured problem-solving and influencing suppliers.

Nice to have

  • Expertise in substrate process building blocks, including component embedding, laser drilling, dielectric lamination, lithography, multi-metal electrolytic plating, defect inspection and metrology, and electrical testing.
  • Experience with process tool qualification in technology development, ramp, or high-volume manufacturing environments.
  • Familiarity with factory operations, substrates, manufacturing, process engineering, and yield improvement.
  • Fluent English communication skills, exceptional presentation abilities, and confidence engaging with supplier management.

Culture & Benefits

  • Hybrid work model allowing time to be split between the assigned hirify.global site and off-site work.
  • Collaboration with global hirify.global teams and suppliers across substrate packaging technology development.
  • Full-time experienced-hire position on Taiwan Shift 1.

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