9 дней назад
ICS Technology Test Vehicle Development Leader (Advanced Packaging)
Вакансия из Hirify Global, списка международных tech-компанийДля мэтча и отклика нужен Plus
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
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TL;DR
ICS Technology Test Vehicle Development Leader (Advanced Packaging): Defining and delivering test vehicles for advanced packaging, substrates, and high-density interconnect technologies with an accent on technology roadmaps, process integration, yield improvement, and electrical, mechanical, and thermal validation. Focus on leading cross-functional development, managing suppliers and project deliverables, solving complex technology qualification challenges, and supporting next-generation heterogeneous integration.
Location: Hsinchu City, Hsinchu County, Taiwan
Company
develops materials and solutions for advanced electronics and high-tech industries.
What you will do
- Define test vehicle strategies aligned with advanced packaging and interconnect technology roadmaps.
- Lead the design, layout, process-flow integration, and delivery of complex test vehicles for heterogeneous integration, advanced substrates, and high-density interconnects.
- Coordinate design, process integration, quality, yield, reliability, manufacturing, suppliers, and external vendors.
- Manage development timelines, budgets, material procurement, fabrication, and deliverables.
- Improve manufacturing yield and validate electrical, mechanical, and thermal performance.
- Identify gaps in test methodologies, drive continuous improvement, and support technology qualification, technical reporting, and patent filings.
Requirements
- Master’s or Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, or a related field.
- 8+ years of experience in advanced packaging, advanced PCB, or HDI interconnect technology development.
- Strong understanding of the vertical value chain spanning PCB MLB, mSAP/HDI, IC substrates, and advanced packaging.
- Experience with design-for-test principles, reliability qualification methodologies, and advanced interconnect process development.
- Proven ability to lead test vehicle design and execution, manage projects, and lead technical teams.
- Strong analytical, problem-solving, communication, and cross-functional collaboration skills.
Nice to have
- Experience with heterogeneous integration, advanced substrate design, and high-density interconnects.
- Prior involvement in cross-functional technology development programs.
Culture & Benefits
- Work in a fast-paced advanced electronics and high-tech environment.
- Collaborate with diverse cross-functional teams and external technology partners.
- Access a comprehensive pay and benefits package.
- Work on next-generation electronics, interconnect, and packaging technologies.
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