Назад
Company hidden
4 дня назад

Senior Substrate Engineer (Semiconductor Packaging)

Формат работы
hybrid
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
Taiwan
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
Для мэтча и отклика нужен Plus

Мэтч & Сопровод

Для мэтча с этой вакансией нужен Plus

Описание вакансии

Текст:
/
TL;DR
Senior Substrate Engineer (Semiconductor Packaging): Developing and integrating advanced substrate manufacturing processes to improve performance, yield, reliability, and cost efficiency with an accent on process optimization, characterization, and high-volume manufacturing. Focus on troubleshooting process issues, implementing data-driven improvements, transferring technologies to production, and collaborating across design, manufacturing, and quality teams.

Location: Taipei or Hsinchu, Taiwan; hybrid work model with at least 4 days per week on-site at the supplier factory.

Company

hirify.global develops semiconductor technologies and advanced substrate packaging solutions through its Asia Capex Substrate Integration group.

What you will do

  • Develop, optimize, and integrate advanced substrate manufacturing processes to improve yield, performance, and product reliability.
  • Collaborate with design, manufacturing, and quality teams to identify and resolve technical challenges.
  • Evaluate and implement new materials, tools, and techniques to improve substrate performance and cost efficiency.
  • Analyze process data, troubleshoot process issues, and drive continuous improvement.
  • Support technology transfer and ramp-up for high-volume manufacturing operations.
  • Document process development results and create production guidelines.

Requirements

  • Bachelor's degree in Materials Science, Chemical Engineering, Mechanical Engineering, or a closely related field.
  • 3+ years of hands-on experience in process integration or substrate development within semiconductor manufacturing.
  • Proficiency in process characterization techniques and tools, including SEM, AFM, X-ray, or similar methodologies.
  • Ability to analyze process data and implement data-driven improvements.
  • Strong knowledge of substrate and packaging technologies in semiconductor applications.

Nice to have

  • Master's or Ph.D. degree in Materials Science, Chemical Engineering, Mechanical Engineering, or a related field with 4+ years of experience.
  • Experience developing innovative solutions to complex technical challenges.
  • Strong communication and collaboration skills for cross-functional teamwork.
  • Familiarity with high-volume manufacturing environments and technology transfer processes.
  • Experience with statistical process control (SPC), design of experiments (DOE), and other quality improvement methods.

Culture & Benefits

  • Hybrid work model combining on-site work at the assigned hirify.global site with off-site work.
  • On-site work at the supplier factory is expected at least 4 days per week.
  • Full-time employment on Shift 1 in Taiwan.
  • Equal employment consideration is provided in accordance with applicable local laws.

Будьте осторожны: если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого - это мошенники. Обязательно жмите "Пожаловаться" или пишите в поддержку. Подробнее в гайде →