Panel Packaging Technology Enablement Director (Advanced Packaging)

Location: Austin, TX or Santa Clara, CA, United States. Full-time role with approximately 25% travel. Relocation eligible.

Salary: $176,000–$242,000 per year.

Company

hirify.global develops materials science, semiconductor manufacturing equipment, process solutions, and integration capabilities for advanced chips and displays.

What you will do

• Define and execute the panel technology enablement roadmap for AI accelerator and high-performance computing packaging.
• Plan and integrate process flows covering core formation, through-glass vias, metallization, fine-line RDL, build-up layers, and panel-scale interconnect.
• Lead complex integration programs from concept through customer transfer, using engineering experiments, DOE, statistical methods, and root-cause analysis.
• Serve as the technical lead for strategic customers, including substrate manufacturers, OSATs, foundries, and accelerator designers.
• Build partnerships with materials suppliers, equipment partners, research institutes, universities, and industry consortia.
• Lead a multidisciplinary engineering team, manage resources and budgets, and drive patents, publications, and technology programs.

Requirements

• Ph.D. in chemistry, materials science, chemical engineering, electrical engineering, physics, or a related field with 12+ years of relevant experience, or an M.S. with 15+ years.
• Hands-on expertise in advanced packaging integration, including 2.5D/3D packaging, high-density substrates, fan-out, or build-up processing.
• Working knowledge of PVD, plating, etch, lithography, and dielectric processes.
• Proven experience leading engineering teams and delivering complex technology programs to customers or high-volume manufacturing.
• Experience presenting to and negotiating with senior customer and partner leadership.
• Track record of patents, publications, and conference presentations.

Nice to have

• Experience with panel-format processing, glass-core substrates, through-glass vias, or sub-5 µm fine-line RDL.
• Knowledge of AI accelerator and HPC architectures, chiplet integration, and HBM co-packaging.
• Relationships across the Asia-Pacific substrate and OSAT ecosystem, plus industry consortium participation.
• Experience managing joint development agreements and multi-party technical programs.

Culture & Benefits

• Supportive environment focused on learning, professional development, and technical innovation.
• Comprehensive employee benefits supporting health and wellbeing.
• Potential eligibility for bonus and stock award programs.
• Equal opportunity employment and accessibility support throughout the application process.