Principal Photonics Package Architect (AI Infrastructure)

Location: San Jose, California, United States (on-site)

Salary: $185,000–$240,000 per year, depending on experience, level, and business need. The role may also be eligible for discretionary bonuses, incentives, and benefits.

Company

hirify.global provides rack-scale AI infrastructure through connectivity solutions based on CXL, Ethernet, NVLink, PCIe, UALink, and its COSMOS software suite.

What you will do

• Define photonics package architecture, electrical and optical interface specifications, and signal and power integrity requirements.
• Establish Thermal Design Power budgets and thermal performance targets.
• Align EIC, PIC, hardware, validation, test, and reliability teams on co-design constraints, optical link budgets, DFT, DFR, and acceptance criteria.
• Finalize bump and ball maps and manage engineering changes and package design database revisions.
• Lead package-level design reviews and own the package design technical roadmap.

Requirements

• Bachelor’s, master’s, or Ph.D. degree in electrical engineering, mechanical engineering, materials science, physics, or a related field.
• 10+ years of experience in semiconductor or photonics package development, package design, or package integration, with demonstrated technical leadership.
• Strong understanding of electrical, optical, thermal, mechanical, and manufacturability trade-offs in package architecture.
• Experience with chip-, board-, and system-level electrical and optical interfaces in complex product development environments.
• Experience with package EDA and electrical simulation tools, including Cadence APD+ and Ansys HFSS.
• Experience with advanced 2.5D and 3D packaging, package design flows, database management, engineering change control, design reviews, risk assessment, and production release.

Nice to have

• Experience with industry-standard optical interfaces and interconnect technologies.
• Experience with advanced photonics packaging for data center interconnects.
• Experience supporting package bring-up and correlating design assumptions with validation results.
• Knowledge of package design for NPO or CPO products.

Culture & Benefits

• Work in a cross-functional environment spanning silicon, photonics, board, validation, test, and reliability teams.
• hirify.global encourages diverse ideas, backgrounds, and experiences.
• Potential eligibility for discretionary bonuses, incentives, and benefits.