Packaging Module Development Engineer (Metrology)

Location: On-site in Phoenix, Arizona, United States; the posting also lists Chandler, Arizona.

Annual salary: $115,110–$219,550 USD.

Company

hirify.global develops advanced computing products and semiconductor manufacturing technologies, including advanced packaging solutions.

What you will do

• Develop, qualify, and sustain metrology systems, measurement methods, inspection equipment, calibration methods, and correlation techniques.
• Improve measurement capability, process control, product quality, reliability, productivity, yield, and manufacturability for Thermal Compression Bonding technologies.
• Apply design of experiments, statistical analysis, and measurement system analysis to improve repeatability, reproducibility, and consistency across tools, sites, and product generations.
• Establish measurement specifications and collaborate with equipment suppliers, quality, process, manufacturing, packaging technology, and partner engineering organizations.
• Provide technical consultation on measurement challenges, equipment issues, lab-to-factory correlation, and metrology process improvements.

Requirements

• Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Physics, Metrology, Instrumentation, Optical Engineering, or a related discipline with 4+ years of experience; alternatively, a relevant master’s degree with 3+ years or PhD with 1+ years of educational or work experience.
• Experience with metrology systems development, measurement equipment qualification, calibration, or measurement method development in a manufacturing, laboratory, or engineering environment.
• Experience with measurement system analysis, including bias, linearity, stability, repeatability, and reproducibility.
• Experience with electrical measurements and testing, optical metrology, microscopes, imaging systems, inspection methods, or machine vision.
• Experience using data analysis tools such as Python, Excel, SQL, or similar tools.
• Ability to work on-site in Phoenix, Arizona, United States.

Nice to have

• Experience in semiconductor manufacturing, preferably advanced packaging.
• Experience with machine vision, automated inspection, camera-based measurement, equipment selection, tool qualification, acceptance testing, and calibration traceability.
• Experience with lab-to-factory correlation, tool matching, DOE, correlation analysis, and metrology method optimization.
• Knowledge of quality systems, measurement documentation, and metrology standardization.
• Experience working with suppliers, vendors, or external calibration and measurement service providers.

Culture & Benefits

• Opportunity to work with experts on advanced packaging technologies and semiconductor manufacturing.
• Health, retirement, vacation, stock bonuses, and other employee benefits are provided.
• Work is performed on-site during Shift 1 in the United States.
• hirify.global supports ethical hiring practices and does not charge recruitment or employment-related fees.