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7 дней назад

Process Integration and Yield Engineering PhD Intern (Semiconductor Manufacturing)

120 898 - 120 902$
Формат работы
onsite
Тип работы
fulltime
Грейд
trainee
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Process Integration and Yield Engineering PhD Intern (Semiconductor Manufacturing): Analyzing defect data, conducting experiments, and refining process integration flows to improve semiconductor manufacturing yield with an accent on microscopy, metrology strategies, and data-driven process optimization. Focus on identifying defect trends, troubleshooting process issues, and applying Python-based analysis to high-volume production improvements.

Location: On-site in Hillsboro, Oregon, United States

Annual salary: $120,898–$120,902 USD

Company

hirify.global Foundry develops and optimizes semiconductor manufacturing processes for high-volume production.

What you will do

  • Analyze defect data, identify trends, and recommend process adjustments.
  • Conduct experiments to evaluate and optimize process integration flows.
  • Collaborate with engineering teams to troubleshoot process issues and refine metrology strategies.
  • Support yield improvement initiatives through risk assessments and data-driven recommendations.
  • Apply advanced data analysis techniques to improve process performance and production efficiency.
  • Participate in continuous improvement projects for semiconductor manufacturing.

Requirements

  • Actively pursuing a Ph.D. in Chemical Engineering, Physics, Electrical Engineering, Materials Science, Chemistry, or a related scientific field.
  • Proficiency in microscopy techniques.
  • Knowledge of semiconductor device physics and circuit design.
  • Basic scripting skills in Python or a comparable programming language.
  • Ability to work on-site in Hillsboro, Oregon, United States.

Nice to have

  • Second- or third-year Ph.D. studies with coursework in semiconductor physics, electronics, or solid-state physics.
  • Hands-on experience with semiconductor manufacturing, microscopy, or engineering analysis tools.
  • Knowledge of JMP, Python, MATLAB, or similar data analysis tools.
  • Familiarity with image analysis software and visual computing systems.
  • GPA of 3.0 or higher.

Culture & Benefits

  • Full-time student internship in a high-volume manufacturing environment.
  • Health, retirement, and vacation benefits.
  • Competitive compensation and stock bonuses.
  • Shift 1 schedule in the United States.

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