Competitive Analysis Engineer (Semiconductor Manufacturing & Architecture)

Location: In-office in Hillsboro, Oregon, United States

Company

hirify.global is an independent research and analysis firm covering the semiconductor and AI industries, including fabrication, hardware, software, infrastructure, industry models, core research, consulting, and technical due diligence.

What you will do

• Conduct end-to-end teardowns and characterization of AI and datacenter hardware from package to die and transistor level.
• Prepare samples and operate analytical equipment, including FIB, SEM, and related characterization tools.
• Interpret imaging and analytical data to assess process integration, materials, design trade-offs, and technology shifts.
• Analyze FEOL, BEOL, and advanced packaging trends across foundries, memory vendors, and OSATs.
• Apply Design Technology Co-Optimization principles to explain process and design decisions, cost implications, and performance outcomes.
• Produce technical research and publications while expanding lab capabilities, workflows, and analytical coverage.

Requirements

• At least 3 years of experience in semiconductor-related roles such as process integration, advanced packaging integration, silicon or hardware engineering, or a closely related field involving leading-edge nodes.
• Broad familiarity with CMOS logic, memory technologies including HBM, GDDR, and 3D NAND, and emerging semiconductor technologies.
• Strong understanding of process integration, product architecture, and Design Technology Co-Optimization principles.
• Ability to reason from physical and structural evidence to process and design intent, while distinguishing real signals from analytical artifacts.
• Hands-on experience or strong aptitude in semiconductor sample preparation and analytical tools such as FIB and SEM.
• Strong technical writing, structured argumentation, independent execution, ownership, and investigative ability.

Nice to have

• Experience with X-ray, PFIB, SEM, TEM, STEM, EELS, EDS, WDS, SIMS, XRF, or XPS.
• Exposure to 2.5D or 3D integration, hybrid bonding, high-speed interconnects, failure analysis, fault isolation, nanoprobing, emission microscopy, or laser and e-beam methods.
• Ability to interpret micrographs and compositional data to infer process and design characteristics.
• Python skills for image analysis, data processing, or lab automation.
• An established network across foundries, memory vendors, and semiconductor packaging companies.

Culture & Benefits

• Work with a global team of more than 50 analysts covering the semiconductor supply chain and AI ecosystem.
• Contribute to industry-shaping research, publications, and thought leadership.
• Gain exposure to advanced technologies and competitive strategies across global semiconductor leaders.
• Opportunity to grow into a lead contributor or domain specialist within the STEEL lab.
• Opportunity to influence research direction, lab investments, and analytical frameworks.
• hirify.global participates in the E-Verify program to confirm employment eligibility for newly hired employees.