Engineer III (Diebond)

Location: Seremban, Malaysia

Company

hirify.global develops semiconductor products and advanced packaging solutions.

What you will do

• Develop and qualify die bond processes, materials, and assembly technologies.
• Lead process development for new semiconductor packages and products.
• Design and execute design of experiments to optimize process performance and reliability.
• Evaluate and introduce die bonding equipment, tools, and process capabilities.
• Support technology transfer from development into mass production.
• Conduct process characterization, capability studies, reliability assessments, root cause analysis, and technical documentation.

Requirements

• Bachelor’s degree in electrical, electronic, mechatronics, manufacturing, materials engineering, or a related field.
• 2–5 years of experience in semiconductor assembly, die attach or die bond process engineering, or advanced manufacturing.
• Fresh graduates with strong academic results and relevant industrial exposure may be considered for entry-level positions.
• Ability to work onsite in Seremban, Malaysia.

Culture & Benefits

• Inclusive and equal-opportunity workplace.
• Accessible recruitment process and reasonable workplace adjustments where requested.
• Employee resource groups, including Pride Network and global and local Women’s groups.
• Commitment to increasing women in management positions to 30% by 2030.