Module Engineer On Shift (MEOS) (Semiconductor Packaging)

Location: On-site in Arizona, United States, with primary locations listed as Phoenix and Chandler. Shift 4 runs from 6:00 PM to 6:00 AM on an alternating weekly schedule, including Sunday–Tuesday nights and alternating Saturday nights.

Annual salary: $85,200–$162,500 USD.

Company

hirify.global develops semiconductor, computing, connectivity, and artificial hirify.globalligence technologies, including next-generation packaging solutions.

What you will do

• Design and develop assembly packaging processes and equipment for next-generation semiconductor technologies.
• Optimize manufacturing processes for quality, reliability, cost, yield, productivity, and manufacturability.
• Apply Statistical Process Control and Design of Experiments to define and refine process and equipment specifications.
• Conduct simulated field-condition tests involving heat, humidity, and dynamic forces to evaluate silicon and package technologies.
• Manage packaging process lifecycles, workflows, manufacturability, qualification, and manufacturing quality systems.
• Collaborate with suppliers, procurement teams, and internal stakeholders on materials, reliability standards, process improvements, and quality issues.

Requirements

• Bachelor’s degree in mechanical engineering, materials science engineering, chemical engineering, electrical engineering, applied technology, or a related field.
• At least 2 years of hands-on experience in assembly and packaging technologies or technology manufacturing.
• Ability to work the overnight Shift 4 schedule in an on-site Arizona manufacturing and engineering environment.
• Strong analytical problem-solving, communication, collaboration, attention to detail, adaptability, and ownership skills.
• This position is not eligible for hirify.global immigration sponsorship.

Nice to have

• Experience with Statistical Process Control and Design of Experiments.
• Experience with laser systems, optical systems, semiconductor assembly, or semiconductor packaging.
• Experience with equipment adjustment, process characterization, and manufacturability.
• Experience using Python, JMP, or Minitab for data analysis and visualization.

Culture & Benefits

• Work alongside cross-functional engineering, manufacturing, supplier, procurement, and stakeholder teams.
• Competitive compensation package with stock bonuses.
• Health, retirement, and vacation benefits.
• Commitment to responsible business practices and ethical hiring.