Principal Engineer, Thermo-Mechanical

Location: US-CA - Santa Clara

Expected base pay: $166,520–$249,500 per annum

Company

hirify.global develops semiconductor solutions and advanced packaging technologies for enterprise, cloud, AI, networking, silicon photonics, and co-packaged optics products.

What you will do

• Lead thermal and thermo-mechanical technology development for advanced semiconductor packaging platforms.
• Define thermal architecture requirements and technology strategies for future AI, networking, silicon photonics, and co-packaged optics products.
• Develop and evaluate TIMs, vapor chambers, liquid cooling, package-integrated cooling, and other emerging cooling technologies.
• Perform thermal, structural, and thermo-mechanical simulations and correlate models with laboratory measurements, package characterization, and reliability data.
• Investigate warpage, stress, deformation, delamination, fatigue, and material degradation failure mechanisms.
• Collaborate with package architects, product engineers, reliability teams, customers, suppliers, and OSAT partners; mentor engineers and represent hirify.global in technical engagements.

Requirements

• Master’s or Ph.D. in Mechanical Engineering, Materials Science, Engineering Mechanics, or a related discipline.
• 10+ years of experience in thermal engineering, thermo-mechanical engineering, advanced packaging, or semiconductor technology development.
• Experience developing thermal and thermo-mechanical solutions for advanced semiconductor packages and heterogeneous integration platforms.
• Strong understanding of heat transfer, structural mechanics, material behavior, package reliability, and failure mechanisms.
• Experience with ANSYS Mechanical, Icepak, Fluent, Abaqus, COMSOL, or equivalent simulation platforms.
• Experience working with OSATs, material suppliers, cooling vendors, and cross-functional engineering teams.

Nice to have

• Experience supporting AI accelerators, networking products, silicon photonics, co-packaged optics, or high-performance computing applications.
• Experience with 2.5D/3D integration, chiplets, heterogeneous integration, hybrid bonding, or advanced substrates.
• Technical publications, patents, or industry leadership in advanced packaging, thermal management, or reliability.

Culture & Benefits

• Full-time employment with bonus and equity plan eligibility.
• New-hire equity grant and annual equity refreshers.
• Employee stock purchase plan with a two-year lookback.
• Family support programs, mental health resources, and recognition and service awards.
• Access to technology and software may be subject to U.S. export control laws and an export license review.

Hiring process

• Interviews assess individual experience, thought process, and communication skills.
• AI tools, transcription apps, automated answer generators, and note-taking bots are not permitted during interviews.