Senior Photonic Engineer for Modulator Design (TFLN)
Контакты
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
c1
Страна
Germany
aistartuppicelectromagnetic simulationphotonicsrf simulationoptical modulatorstflnlithium niobateelectro optical co design
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Hirify AI/Оригинал
TL;DR
Senior Photonic Engineer for Modulator Design (TFLN): Designing thin-film lithium niobate electro-optic modulators for photonic integrated circuits with an accent on optical mode solving, RF/microwave design, and driver–modulator co-simulation. Focus on taking architectures from concept through tape-out and validation, addressing process variation, and developing reusable PDK elements for photonic computing applications.
Location: Stuttgart, Baden-Württemberg, Germany
Company
Develops photonic processors that compute with light using thin-film lithium niobate photonic integrated circuits for AI and high-performance computing.
Run optical mode solving, RF/microwave simulation, and driver–modulator co-simulation.
Support tape-outs and validate components with the characterization team, using measurement results to improve designs.
Build reusable PDK elements and parametric cells to accelerate design-to-tape-out cycles.
Address manufacturability and process variation with the fabrication team, and translate system specifications into modulator targets.
Mentor junior PIC designers and develop novel modulator concepts and invention disclosures.
Requirements
Master’s degree or PhD in Photonics, Electrical Engineering, Applied Physics, or a related field.
At least 3 years of photonic device design experience, including at least 1 year designing high-speed GHz optical modulators in an industrial environment.
Proven experience designing modulators that were taped out and tested.
Solid knowledge of thin-film lithium niobate device physics, the Pockels effect, waveguide design, and travelling-wave electrode design.
Hands-on experience with photonic, RF, or electromagnetic simulation and electro-optical co-design, including driver/DAC interfaces.
Fluent English required.
Nice to have
Circuit and link co-simulation using S-parameters, eye diagrams, and link budgets.
Knowledge of photonic packaging and RF interconnects, including wire bonds and RF transitions.
Patents or publications in modulator design.
Culture & Benefits
Self-responsibility and accelerated professional development.
Fast-paced environment that encourages experimentation.
Opportunity to develop photonic computing technology for the future of computing.
International, highly skilled, cross-functional team.
Access to the company founders.
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