SiC Process Engineer, Final Operations

Location: On-site in Newport, UK, United Kingdom

Company

hirify.global develops and manufactures semiconductor technologies and electronic components.

What you will do

• Develop, qualify, industrialise, and optimise SiC wafer-fabrication process modules, focusing on Laser Anneal, Back Metal Deposition, and Backgrind.
• Own assigned processes and equipment sets, including process specifications, operating windows, design rules, and technical documentation.
• Plan and execute process-development and process-integration activities, structured experiments, and analysis of process, metrology, and electrical data.
• Support technology and product transfer from R&D into manufacturing, including qualification and production ramp-up.
• Implement improvements to capability, yield, quality, cycle time, cost, and equipment utilisation.
• Lead process-control activities and investigations into deviations, defects, excursions, and corrective actions.

Requirements

• Bachelor’s degree in Electrical Engineering, Materials Science, Physics, Chemistry, or a related discipline with at least five years of semiconductor process-engineering or process-development experience; alternatively, a relevant Master’s degree or PhD with at least three years of experience.
• Experience in a semiconductor wafer-fabrication environment and in developing, qualifying, or sustaining wafer-fabrication process modules.
• Knowledge of semiconductor devices, wafer-fabrication processes, and industrial semiconductor manufacturing.
• Ability to design structured experiments, interpret process and electrical data, and apply SPC, FMEA, OCAP, Kaizen, TPM, and structured problem-solving.
• Strong technical communication skills and the ability to work across R&D, Engineering, Production, Quality, Equipment Engineering, and New Product Introduction functions.
• Flexibility to support manufacturing and qualification activities outside normal working hours when reasonably required.

Nice to have

• Experience with SiC power-device manufacturing, wide-bandgap semiconductor processing, or comparable advanced wafer-fabrication technologies.
• Process or equipment ownership experience in Back Metal Deposition, Laser Anneal, or Wafer Thinning.

Culture & Benefits

• Funded training and development, including opportunities up to master’s-degree level.
• Annual bonus scheme, medical cover options, Smart Pension contributions, and life assurance equivalent to four times annual salary.
• Employee assistance programme, career-development opportunities, and retail, sports, and entertainment discounts.
• On-site fitness centre, restaurant, outdoor gardens, sports and social clubs, and free on-site parking.