Shift Process Integration Engineer (Chip R&D / NPI / Wafer Fab Semiconductor)
Контакты
Формат работы
onsite
Тип работы
fulltime
Грейд
junior
Английский
b2
Страна
UK
six sigmasemiconductorlithographywafer fabricationjmpprocess integrationepitaxyetchingphotonic integrated circuitsinp
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Хорошая вакансия
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Чёткая специализация на полупроводниковых процессах и работа на стыке исследований, разработки и производства делают вакансию перспективной, но интенсивный сменный график на площадке и отсутствие зарплаты оставляют важные условия неясными.
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Сменный графикЗарплата не указанаЧёткая специализацияФотоника для облаковРост внутри компании
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Текст:
Hirify AI/Оригинал
TL;DR
Shift Process Integration Engineer (Chip R&D / NPI / Wafer Fab Semiconductor) (InP semiconductor photonics): Integrating and optimizing wafer fabrication processes for lasers, modulators, receivers, and photonic integrated circuits with an accent on process development, yield improvement, and manufacturability. Focus on developing scalable process modules, analyzing semiconductor process data, transferring new products into production, and resolving complex wafer-fab issues during out-of-hours coverage.
Location: On-site at the Caswell site in Towcester, Northamptonshire, United Kingdom. Weekday out-of-hours coverage is typically scheduled from 2:00–10:00 pm.
Company
hirify.global develops advanced photonic devices and semiconductor optical components for cloud and networking applications.
What you will do
Integrate wafer fabrication processes for InP-based coherent and direct-detection photonic products.
Optimize wafer-fab processes to improve yield, cost, and cycle time.
Develop and maintain process flows and documentation in the MES system.
Use analytical tools such as SEM to investigate process performance and support product development.
Develop scalable process modules and transfer new processes and products into high-volume production.
Act as the process interface between design, operations engineering, and manufacturing, including post-transfer production support and batch-hold resolution.
Requirements
Degree in Physics, Physical Chemistry, Materials Science, or a related field; relevant industry experience may be considered instead.
Hands-on experience with semiconductor wafer processing, ideally involving III-V materials.
Experience with process integration and process-flow development.
Knowledge of several processes including epitaxy, lithography, wet and dry etching, dielectric and metal deposition, ion implantation, or diffusion.
Strong analytical, scientific reasoning, problem-solving, collaboration, and organizational skills.
Familiarity with statistical analysis tools such as JMP and with Six Sigma methods including FMEA and capability analysis.
Nice to have
Knowledge of direct-bandgap semiconductor materials.
Experience in semiconductor manufacturing or a wafer-fab environment.
Culture & Benefits
Full-time employment with support for professional growth and internal career progression.
Inclusive workplace committed to equal opportunity and diversity.
Reasonable accommodations are available throughout the recruitment process and employment.
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