Senior Principal Packaging Engineer

Location: Chandler, United States — office-based. Other listed locations include Nijmegen and Austin.

Company

hirify.global develops semiconductor solutions for vehicle electrification, power management, robotics, and high-performance computing and datacenter applications.

What you will do

• Define package architectures, materials, structures, and assembly process flows for new products and technologies.
• Lead cross-functional technical programs involving design, engineering, manufacturing, quality, reliability, suppliers, OSATs, and external technology partners.
• Monitor advanced packaging, panel-level packaging, and power packaging trends and drive technology roadmaps.
• Deliver package activities across feasibility, design, prototyping, characterization, qualification, risk retirement, release, and production ramp.
• Travel internationally to assembly sites, OSATs, suppliers, and technology partners when required.

Requirements

• Bachelor’s degree or higher in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, or a related field.
• 10+ years of experience in semiconductor packaging, assembly process development, package design, product/package engineering, or related areas.
• Working knowledge of QFP, QFN, BGA, FCBGA, FCCSP, WLCSP, FOWLP, FOPLP/PLP, SiP/modules, and power packages.
• Experience leading cross-functional technical projects across engineering, manufacturing, product, quality, supplier, and management organizations.
• Ability to communicate technical tradeoffs, risks, recommendations, and project status to technical and management audiences.
• Fluent English communication skills, written and verbal.

Nice to have

• Expertise in fan-out packaging, panel-level packaging, 2.5D/3D integration, chiplets, heterogeneous integration, embedded die/passives, SiP/modules, high-density substrates/RDL, hybrid bonding, or high-power packaging.

Culture & Benefits

• Work with internal assembly sites, OSATs, material suppliers, and external technology partners.
• Opportunity to contribute to semiconductor technologies supporting vehicle electrification, robotics, power management, and high-performance computing.
• International collaboration and travel across manufacturing and technology partner locations.