Process Integrator (Advanced Packaging & Co-Packaged Optics R&D)

Location: Albany, New York; on-site R&D role. Salary location also includes Santa Clara, California. Periodic domestic and international travel may be required, approximately 10% of the time. Relocation eligible.

Salary: $176,000.00–$242,000.00 per year

Company

hirify.global develops materials science and engineering solutions for semiconductor and advanced display manufacturing.

What you will do

• Own end-to-end process integration for advanced packaging and heterogeneous integration programs from concept and architecture through demonstration and technology transfer.
• Develop integrated process flows for photonic integrated circuits, electronic ICs, optical engines, interposers, substrates, and fiber interfaces.
• Translate optical, electrical, thermal, mechanical, reliability, and manufacturability requirements into integration specifications and measurable success criteria.
• Lead cross-functional execution across photonics, device, packaging, bonding, lithography, deposition, etch, clean, CMP, plating, metrology, testing, failure analysis, modeling, and reliability teams.
• Drive photonic and electronic die integration, including die-to-wafer and wafer-to-wafer bonding, fine-pitch interconnects, optical coupling and alignment, fiber attach, and advanced substrate integration.
• Create technology roadmaps, risk assessments, integration reviews, executive-ready reports, and intellectual property contributions.

Requirements

• MS or PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Applied Physics, Photonics, or a related technical field.
• 5–10 years of experience in semiconductor process integration or process integration R&D.
• Experience building and executing integrated semiconductor or photonics process flows across multiple process modules and engineering teams.
• Strong understanding of co-packaged optics, silicon photonics, photonic integrated circuits, optical engines, or optical/electrical heterogeneous integration.
• Knowledge of die integration, optical coupling and alignment, fiber attach, fine-pitch interconnects, substrates, interposers, thermal management, defect mechanisms, metrology, characterization, and reliability.
• Experience with experiments, statistical analysis, DOE methods, technical risk, and communicating complex integration issues to technical and executive audiences.

Nice to have

• Experience with 2.5D/3D integration, hybrid or fusion bonding, TSVs, chiplets, advanced substrates, interposers, or wafer-level packaging.
• Experience working with customers, research consortia, universities, suppliers, or ecosystem partners on emerging technology programs.
• Patents, publications, invited presentations, or technical leadership in semiconductor integration, advanced packaging, or photonics.

Culture & Benefits

• Supportive environment focused on learning, development, and professional growth.
• Collaboration across a global R&D organization, business units, customers, partners, and suppliers.
• Comprehensive employee benefits and health and wellbeing programs.
• Potential eligibility for bonus and stock award programs, subject to applicable conditions.
• Regular travel may support customers, partners, and cross-site teams.