Packaging Process Development Engineer (Semiconductor Packaging)

Location: On-site in Phoenix, Arizona, United States

Annual salary: $99,030–$188,890 USD

Company

hirify.global is a semiconductor technology company developing products and solutions across computing, connectivity, and artificial hirify.globalligence.

What you will do

• Develop and optimize assembly media, collaterals, processes, and equipment for quality, reliability, cost, yield, productivity, and manufacturability targets.
• Apply Design of Experiments and Statistical Process Control to refine capabilities and document technical findings.
• Design and maintain equipment for evaluating performance under temperature, heat, humidity, and dynamic mechanical conditions.
• Ensure physical prototype manufacturability and oversee manufacturing workflows and qualification practices.
• Define material specifications and collaborate with supplier quality and procurement teams.
• Lead problem-solving and continuous improvement initiatives while advising internal teams and external partners.

Requirements

• Bachelor’s degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of experience, or a master’s degree in a related field.
• Knowledge of mechanical design software such as SolidWorks or AutoCAD.
• Knowledge of mechanical drawings and Geometric Dimensioning and Tolerancing principles.
• Ability to work collaboratively, communicate technical concepts clearly, analyze complex problems, and manage shifting priorities.
• Ability to work on-site in Phoenix, Arizona, United States.

Nice to have

• Experience with Statistical Process Control and Design of Experiments methodologies.
• Experience with high-precision manufacturing methods, including stamping and CNC machining.
• Experience with semiconductor fabrication processes and packaging technologies.
• Experience with supply chain management in manufacturing or materials qualification environments.
• Experience driving technical innovation and managing complex, time-sensitive projects.

Culture & Benefits

• Collaborative, cross-functional work with colleagues, suppliers, and external partners.
• Health, retirement, and vacation benefits.
• Competitive compensation with potential stock bonuses.
• Work in an innovation-focused semiconductor packaging environment.