Packaging Module Development Engineer (Semiconductor Packaging)

Location: On-site in Phoenix, Arizona, United States; regular onsite presence is required

Annual salary: $133,800–$188,890 USD

Company

Develops semiconductor packaging technologies, manufacturing processes, and equipment for future package platforms.

What you will do

• Develop assembly processes and equipment for innovative semiconductor packaging technologies.
• Optimize manufacturing processes for quality, reliability, cost, yield, productivity, and manufacturability.
• Create process and equipment specifications using Design of Experiments and data analysis.
• Develop and maintain equipment for evaluating silicon and package technologies under simulated field-use conditions.
• Define material specifications and collaborate with contract assemblers, suppliers, quality, and procurement teams.
• Develop reliability screens, acceleration methods, qualification standards, and continuous process improvements.

Requirements

• PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics, Applied Physics, or a related field.
• At least 1 year of experience applying statistical analysis, including DOE and SPC, for technical root-cause analysis.
• At least 1 year of experience in process development, characterization, optimization, or qualification in semiconductor manufacturing, packaging, materials engineering, or a related advanced technology environment.
• Experience with data analysis tools such as Python, MATLAB, JMP, Minitab, or equivalent software.
• Knowledge of reliability engineering, failure mechanisms, and accelerated stress testing methods.
• Regular onsite work in Phoenix, Arizona, is required.

Nice to have

• Cumulative GPA of 3.5 or higher.

Culture & Benefits

• Full-time experienced-hire position.
• Competitive pay and stock bonuses.
• Health, retirement, and vacation benefits.
• Shift 1 schedule in the United States.