3 дня назад
Silicon Photonics Advanced Packaging Intern (Summer 2027)
20 - 40$
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Silicon Photonics Advanced Packaging Intern (Summer 2027) (Silicon Photonics/Advanced Packaging): Supporting the development of electro-optical transceivers using Photonix, 2.5D, and 3D co-packaged optics with an accent on chip-package co-design, packaging design, materials selection, and chiplet integration. Focus on developing simulation models, resolving manufacturability and reliability concerns, and supporting qualification from concept through production readiness.
Location: USA - New York - Malta; full-time internship with up to 10% travel.
Expected salary range: $20.00–$40.00.
Company
manufactures semiconductors and develops power-efficient, high-performance solutions for growth markets including AI.
What you will do
- Support silicon photonics advanced packaging innovation and customer design enablement for the Photonix platform.
- Contribute to packaging design rules, product requirements, manufacturing processes, and advanced chiplet integration.
- Participate in cross-functional design reviews and help resolve technical, manufacturability, reliability, and yield concerns.
- Develop and apply analysis or simulation models to evaluate package performance, cost, quality, and manufacturability.
- Support qualification robustness, continuous improvement, requirements tracking, and product development through production readiness.
- Follow Environmental, Health, Safety & Security requirements and programs.
Requirements
- Actively pursuing a Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Photonics, Optical Engineering, Packaging Engineering, or a related field.
- Overall GPA of at least 3.0 and good academic standing.
- English fluency required for written and verbal communication.
- Ability to work at least 40 hours per week during the internship.
- Ability to travel up to 10%.
Nice to have
- Internship, research, or co-op experience in semiconductor packaging, photonics, optics, or advanced electronics.
- Experience with thermal, mechanical, electrical, optical, or multiphysics simulation tools.
- Knowledge of semiconductor packaging, chiplets, silicon photonics, or co-packaged optics.
- Leadership, project management, planning, organizational, communication, and innovation skills.
- Interest in using AI tools and emerging technologies to improve productivity and decision-making.
Culture & Benefits
- One-on-one mentorship and work assignments focused on professional growth.
- Professional development opportunities and networking with executives.
- Experience within the semiconductor industry and exposure to internal teams and OSAT ecosystem partners.
Будьте осторожны: если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого - это мошенники. Обязательно жмите "Пожаловаться" или пишите в поддержку. Подробнее в гайде →
Похожие вакансии
4 дня назад
Photonic System Design Engineer (Silicon Photonics)
164 470 - 269 100$
7 дней назад
2027 Summer Mechanical Engineer Intern (Semiconductor Equipment)
31 - 41$
8 дней назад
Integrated Circuits Intern (Summer 2027)
20 - 45$
7 дней назад
Process Engineer (Semiconductor Manufacturing)
30 - 40$
7 дней назад
2027 Summer Intern - Process Engineer - BS/MS Degree (Santa Clara, CA) (Semiconductor Manufacturing)
10 дней назад
2026 Process Engineer Co-op - Adv Degree (Semiconductor)
41 - 50$