Назад
Company hidden
3 дня назад

Silicon Photonics Advanced Packaging Intern (Summer 2027)

20 - 40$
Формат работы
onsite
Тип работы
fulltime
Грейд
trainee
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
Для мэтча и отклика нужен Plus

Мэтч & Сопровод

Для мэтча с этой вакансией нужен Plus

Описание вакансии

Текст:
/
TL;DR
Silicon Photonics Advanced Packaging Intern (Summer 2027) (Silicon Photonics/Advanced Packaging): Supporting the development of electro-optical transceivers using Photonix, 2.5D, and 3D co-packaged optics with an accent on chip-package co-design, packaging design, materials selection, and chiplet integration. Focus on developing simulation models, resolving manufacturability and reliability concerns, and supporting qualification from concept through production readiness.

Location: USA - New York - Malta; full-time internship with up to 10% travel.

Expected salary range: $20.00–$40.00.

Company

hirify.global manufactures semiconductors and develops power-efficient, high-performance solutions for growth markets including AI.

What you will do

  • Support silicon photonics advanced packaging innovation and customer design enablement for the Photonix platform.
  • Contribute to packaging design rules, product requirements, manufacturing processes, and advanced chiplet integration.
  • Participate in cross-functional design reviews and help resolve technical, manufacturability, reliability, and yield concerns.
  • Develop and apply analysis or simulation models to evaluate package performance, cost, quality, and manufacturability.
  • Support qualification robustness, continuous improvement, requirements tracking, and product development through production readiness.
  • Follow Environmental, Health, Safety & Security requirements and programs.

Requirements

  • Actively pursuing a Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Photonics, Optical Engineering, Packaging Engineering, or a related field.
  • Overall GPA of at least 3.0 and good academic standing.
  • English fluency required for written and verbal communication.
  • Ability to work at least 40 hours per week during the internship.
  • Ability to travel up to 10%.

Nice to have

  • Internship, research, or co-op experience in semiconductor packaging, photonics, optics, or advanced electronics.
  • Experience with thermal, mechanical, electrical, optical, or multiphysics simulation tools.
  • Knowledge of semiconductor packaging, chiplets, silicon photonics, or co-packaged optics.
  • Leadership, project management, planning, organizational, communication, and innovation skills.
  • Interest in using AI tools and emerging technologies to improve productivity and decision-making.

Culture & Benefits

  • One-on-one mentorship and work assignments focused on professional growth.
  • Professional development opportunities and networking with executives.
  • Experience within the semiconductor industry and exposure to internal teams and OSAT ecosystem partners.

Будьте осторожны: если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого - это мошенники. Обязательно жмите "Пожаловаться" или пишите в поддержку. Подробнее в гайде →