MTS 3D Heterogenous Integration Engineer

Location: Malta, New York, USA

Salary: $98,000–$176,000 per year

Company

hirify.global is a full-service semiconductor foundry providing design, development, and fabrication services with a global manufacturing footprint.

What you will do

• Lead 3D heterogeneous integration process development for multi-die stacking, die-to-wafer and wafer-to-wafer fine-pitch hybrid bonding, TSV/TOV, and interposer technologies.
• Develop thermal solutions addressing power density, hotspot mitigation, thermal spreading, and package-level heat removal.
• Drive end-to-end process integration and planning for new capabilities and early product prototypes.
• Collaborate with unit-process and manufacturing engineers, tool and material vendors, OSAT partners, and joint-development partners.
• Analyze process data, interpret results, identify failure modes, and resolve process integration challenges.
• Develop expertise in processes, materials, and tooling, and generate intellectual property related to advanced wafer integration and packaging.

Requirements

• Master’s degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related field.
• At least 5–6 years of related experience with a master’s degree.
• In-depth knowledge of BEOL processes and integration, advanced bonding, TSVs, bump and wafer-finish integration, wafer test/probe, OSAT collaboration, package development, assembly, and thermal management.
• Strong problem-solving and technical troubleshooting skills, including design of experiments.
• Overall GPA of at least 3.0 and demonstrated good academic standing.
• Fluent written and verbal English required; travel up to 20%.

Nice to have

• PhD education level with 3–4 years of related experience.
• Leadership experience within an organization or the OSAT ecosystem.
• Project management, strong communication, planning, and organizational skills.

Culture & Benefits

• Work within the Advanced Packaging Lab on advanced semiconductor packaging technologies.
• Participate in hiring activities and mentor new hires.
• Support environmental, health, safety, and security programs.
• Employment is subject to applicable pre-employment conditions and laws.