Advanced Packaging TD Plating Module Engineer (Semiconductor)

Location: On-site in Hillsboro, Oregon, United States

Annual salary: $133,800–$255,200 USD

Company

hirify.global develops semiconductor technologies and advanced packaging manufacturing processes for high-volume production.

What you will do

• Develop and optimize advanced manufacturing processes, including material selection, equipment metrology, and system design.
• Conduct feasibility studies and simulations against device performance and reliability specifications.
• Drive process innovation and pathfinding for next-generation semiconductor architectures.
• Collaborate with equipment and material suppliers to implement innovative process technologies.
• Develop technology roadmaps and improve production scalability, efficiency, and output.
• Use statistical process control and data analytics to ensure process stability and continuous improvement.

Requirements

• Master’s degree in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Chemistry, or a related STEM field plus 4+ years of relevant experience; or a PhD in these fields plus 2+ years of relevant experience.
• At least 2 years of experience in semiconductor processing, advanced packaging technology development, process development methodologies, statistical process control, or manufacturing process improvement.
• Experience solving complex engineering challenges and collaborating with cross-functional teams.
• Ability to work on-site in Hillsboro, Oregon, United States.

Nice to have

• Expertise in plasma etch, plating processes, or thin-film deposition.
• Experience with wafer-level assembly, hybrid bonded interconnects, or advanced packaging technologies.
• Experience leading programs from strategy formation through high-volume production.
• Collaboration experience with yield, operations, and supplier management teams.

Culture & Benefits

• Work within hirify.global’s Advanced Packaging Technology Development organization.
• Health, retirement, and vacation benefits.
• Competitive pay and stock bonuses.
• Focus on semiconductor technology innovation, manufacturing scalability, and product reliability.