Module Engineering - Day Shift 5 or 7 (Semiconductor Packaging)

Location: On-site in Chandler or Phoenix, Arizona, United States. Day shift 5 or 7, 6 AM–6 PM, on a compressed work week. US citizenship is required.

Annual salary: $85,200–$162,500 USD

Company

hirify.global develops semiconductor technologies and advanced foundry packaging solutions for a broad ecosystem of technology customers.

What you will do

• Design and develop assembly processes and equipment for next-generation foundry packaging technologies.
• Optimize manufacturing processes for quality, reliability, cost, yield, productivity, and manufacturability.
• Define process and equipment specifications using statistical process control, design of experiments, and data analysis.
• Develop equipment and methods for thermal, humidity, mechanical stress, and other package reliability testing.
• Establish material specifications and coordinate process compliance with contract assemblers, suppliers, procurement, and quality teams.
• Lead continuous improvement, reliability screening, qualification, standardization, troubleshooting, and technical support for foundry packaging.

Requirements

• US citizenship required.
• Bachelor’s degree with at least 1 year of relevant experience, or a master’s degree, in mechanical engineering, materials science engineering, chemical engineering, electrical engineering, or a related STEM field.
• At least 6 months of experience with statistical process control and/or design of experiments principles.
• Experience applying engineering, manufacturing, data analysis, and experimental design methods.

Nice to have

• Experience in a technology or semiconductor manufacturing environment.
• Experience with semiconductor packaging assembly, materials, or reliability engineering in a foundry context.

Culture & Benefits

• Full-time employment with on-site work in Arizona.
• Health, retirement, and vacation benefits.
• Competitive pay and stock bonuses.
• Opportunity to collaborate with packaging, manufacturing, technology development, supplier quality, and partner engineering teams.