Teach Lead Physical Design Engineer (Semiconductor)
Контакты
Формат работы
onsite
Тип работы
fulltime
Грейд
senior/lead
Английский
b2
Страна
Singapore
pythonphysical designroutingtclserdesclock tree synthesisphysical verificationfloorplanningplacementtiming closure
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Путаница с уровнемЗарплата не указанаСовременные технологииAI-инфраструктура
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Текст:
Hirify AI/Оригинал
TL;DR
Teach Lead Physical Design Engineer (Semiconductor): Implementing high-performance transceiver IPs for TSMC 3nm and advanced technology nodes with an accent on floorplanning, placement, clock tree synthesis, routing, and physical verification. Focus on timing, power, congestion, EM/IR, signoff closure, and automation of physical design flows.
Location: Singapore, Singapore
Company
hirify.global provides rack-scale AI infrastructure through connectivity solutions based on CXL, Ethernet, NVLink, PCIe, and UALink technologies, supported by its COSMOS software suite.
What you will do
Perform block-level and top-level physical implementation for high-speed transceiver designs at TSMC 3nm and advanced technology nodes.
Handle floorplanning, placement, clock tree synthesis, routing, physical verification, ECO implementation, and tapeout signoff support.
Collaborate with RTL and STA teams on timing, area, and power convergence.
Optimize EM/IR performance, power grids, congestion, clock skew, clock quality, and RC-aware placement and routing.
Integrate high-speed IPs and top-level blocks with aligned physical interfaces, constraints, and timing.
Develop Tcl, Python, or Perl automation scripts to improve physical design flows and productivity.
Requirements
Bachelor’s or Master’s degree in Electrical Engineering, Electronics Engineering, or a related field.
5+ years of physical design experience, preferably with advanced technology nodes.
Strong experience with floorplanning, placement, CTS, routing, IR drop mitigation, timing closure, and physical verification.
Hands-on experience with ICC2, Innovus, Calibre, Voltus, RedHawk, and related industry-standard tools.
Experience integrating SerDes or PHY IPs into SoC or chiplet-based environments and working with high-frequency datapath and DSP-related designs.
Solid scripting, problem-solving, and cross-functional collaboration skills.
Culture & Benefits
Work with a high-performance design team developing next-generation semiconductor connectivity solutions.
Inclusive environment that encourages applications from people with diverse backgrounds and experiences.
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