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10 дней назад

Teach Lead Physical Design Engineer (Semiconductor)

Формат работы
onsite
Тип работы
fulltime
Грейд
senior/lead
Английский
b2
Страна
Singapore
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR
Teach Lead Physical Design Engineer (Semiconductor): Implementing high-performance transceiver IPs for TSMC 3nm and advanced technology nodes with an accent on floorplanning, placement, clock tree synthesis, routing, and physical verification. Focus on timing, power, congestion, EM/IR, signoff closure, and automation of physical design flows.

Location: Singapore, Singapore

Company

hirify.global provides rack-scale AI infrastructure through connectivity solutions based on CXL, Ethernet, NVLink, PCIe, and UALink technologies, supported by its COSMOS software suite.

What you will do

  • Perform block-level and top-level physical implementation for high-speed transceiver designs at TSMC 3nm and advanced technology nodes.
  • Handle floorplanning, placement, clock tree synthesis, routing, physical verification, ECO implementation, and tapeout signoff support.
  • Collaborate with RTL and STA teams on timing, area, and power convergence.
  • Optimize EM/IR performance, power grids, congestion, clock skew, clock quality, and RC-aware placement and routing.
  • Integrate high-speed IPs and top-level blocks with aligned physical interfaces, constraints, and timing.
  • Develop Tcl, Python, or Perl automation scripts to improve physical design flows and productivity.

Requirements

  • Bachelor’s or Master’s degree in Electrical Engineering, Electronics Engineering, or a related field.
  • 5+ years of physical design experience, preferably with advanced technology nodes.
  • Strong experience with floorplanning, placement, CTS, routing, IR drop mitigation, timing closure, and physical verification.
  • Hands-on experience with ICC2, Innovus, Calibre, Voltus, RedHawk, and related industry-standard tools.
  • Experience integrating SerDes or PHY IPs into SoC or chiplet-based environments and working with high-frequency datapath and DSP-related designs.
  • Solid scripting, problem-solving, and cross-functional collaboration skills.

Culture & Benefits

  • Work with a high-performance design team developing next-generation semiconductor connectivity solutions.
  • Inclusive environment that encourages applications from people with diverse backgrounds and experiences.

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