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10 дней назад

Principal Physical Design Engineer

Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
Singapore
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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TL;DR
Principal Physical Design Engineer (AI Infrastructure/Advanced Nodes): Implementing high-speed transceiver IPs at block and top level for TSMC 3nm and advanced technology nodes with an accent on floorplanning, timing closure, physical verification, and power optimization. Focus on integrating SerDes and PHY IPs, solving congestion and clock-quality challenges, and completing ECO and tapeout signoff activities.

Location: Singapore, Singapore

Company

hirify.global provides rack-scale AI infrastructure through semiconductor-based connectivity solutions integrating CXL, Ethernet, NVLink, PCIe, UALink, and the COSMOS software suite.

What you will do

  • Perform block-level and top-level physical implementation, including floorplanning, placement, clock tree synthesis, routing, and physical verification.
  • Collaborate with RTL and STA teams on timing, area, and power convergence.
  • Optimize EM/IR performance, power grids, congestion, clock skew, clock quality, and RC extraction-aware placement and routing.
  • Integrate high-speed IPs and top-level blocks with aligned physical interfaces, constraints, and timing.
  • Implement ECOs and support tapeout signoff while maintaining DRC, LVS, ANT, CELL, and ERC-clean databases.
  • Develop automation scripts in Tcl, Python, or Perl to improve physical design flows and productivity.

Requirements

  • Bachelor’s or Master’s degree in Electrical Engineering, Electronics Engineering, or a related field.
  • 5–10 years of physical design experience, preferably with advanced technology nodes.
  • Strong experience with floorplanning, placement, CTS, routing, IR drop mitigation, signoff debugging, and timing closure.
  • Hands-on experience with Synopsys ICC2, Cadence Innovus, Calibre, and Voltus.
  • Experience integrating SerDes or PHY IPs into SoC or chiplet-based environments.
  • Experience with high-frequency datapath and DSP-related designs, scripting, problem-solving, and cross-functional collaboration.

Culture & Benefits

  • Work with diverse teams and perspectives across next-generation AI infrastructure projects.
  • Inclusive environment encouraging applications from people with varied backgrounds and experiences.

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